丝印：K522；Package：SOT23-5；Rail-to-rail 1.8 V high-speed comparator

Features • Propagation delay: 38 ns • Low current consumption: 73 μA • Rail-to-rail inputs • Push-pull outputs • Supply operation from 1.8 to 5 V • Wide temperature range: -40 °C to 125 °C • High ESD tolerance: 5 kV HBM, 300 V MM • SMD packages • Automotive qualification Applications

文件：610.09 Kbytes 页数：16 Pages

STMICROELECTRONICS

意法半导体

丝印：K522；Package：SOT23-5；Rail-to-rail 1.8 V high-speed comparator

Features • Propagation delay: 38 ns • Low current consumption: 73 μA • Rail-to-rail inputs • Push-pull outputs • Supply operation from 1.8 to 5 V • Wide temperature range: -40 °C to 125 °C • High ESD tolerance: 5 kV HBM, 300 V MM • SMD packages • Automotive qualification Applications

文件：993.33 Kbytes 页数：17 Pages

STMICROELECTRONICS

意法半导体

MCP Specification

GENERAL DESCRIPTION The K522H1HACF is a Multi Chip Package Memory which combines 2G bit NAND Flash and 1G bit Mobile DDR synchronous Dynamic RAM. NAND cell provides the most cost-effective solution for the solid state application market. A program operation can be performed in typical 250μs on th

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