IRKU91SLASH08AS90技术资料参数贸易商IRF-114ic电子网

型号	下载订购	功能描述	制造商上传企业	LOGO
IRKU91SLASH08AS90	文件：175.36 Kbytes Page：9 Pages	THYRISTOR/ THYRISTOR 文件：175.36 Kbytes 页数：9 Pages	IRF	IRF
IRKH91SLASH08AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKL91SLASH08AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKN91SLASH08AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF

更多IRKU91SLASH08AS90供应商更新时间2026-2-4 14:00:00