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The CM273SM IEEE 802.11 a/b/g/n/ac SDIO Wi-Fi with Bluetooth 4.1 combo stamp module is a highly integrated wireless local area network (WLAN) solution to let users enjoy the digital content through the latest wireless technology without using the extra cables and cords. It combines with Bluetooth 4.1 and provides a complete 2.4GHz Bluetooth system which is fully compliant to Bluetooth 4.1 and v2.1 that supports EDR of 2Mbps and 3Mbps for data and audio communications. It enables a high performance, cost effective, low power, compact solution that easily fits onto the SDIO and UART stamp module.
Compliant with the IEEE 802.11a/b/g/n/ac standard, AW-CM273SM uses Direct Sequence Spread Spectrum (DSSS), Orthogonal Frequency Division Multiplexing (OFDM), BPSK,QPSK,CCK and QAM baseband modulation technologies.
A high level of integration and full implementation of the power management functions specified in the IEEE 802.11 standard minimize system power requirements by using AW-CM273SM.
AW-CM273SM module adopts QCA9377 single chip solution. The module design is based on the QCA9377 solution.
Model Name AW-CM273SM Product Description Wireless LAN &Bluetooth Stamp Module WLAN Standard IEEE 802.11 a/b/g/n/ac Bluetooth Standard Bluetooth 2.1+Enhanced Data Rate (EDR)+ BT4.1 Major Chipset QCA9377-3 Host Interface Wi-Fi : SDIO, BT :UART Dimensions 12mm X 12mm x 1.8mmMax Wi-Fi VID/PID 0271/0701 Weight 0.25g Operating Conditions Voltage power supply for host:3.3V Temperature -20~85 ℃ Storage temperature -40~105 ℃ Electrical Specifications Frequency Range WLAN: 2.4 GHz ISM Bands 2.412-2.472 GHz