BMF055 博世9轴运动传感器加算法输出 方便设计 快速成型产品，应用于可穿戴 物联网
BMF055 价格咨询 13828760986赵工
像其竞争对手InvenSense一样，Bosch Sensortec也推出了一款可编程9轴运动传感器BMF055，可以根据特殊应用（如机器人、游戏、物联网设备）进行定制化编程。
BMF055是博世新款9轴运动传感器（16位数字输出3轴陀螺仪+14位数字输出3轴加速度计+3轴磁力计），通过系统级封装（SiP）集成32位ARM Cortex M0+内核MCU。相比单独的传感器中枢，BMF055减少封装成本，且有助于减小系统级功耗。
博世BMF055封装
BMF055极为适合用户对于开发先进应用特定型传感器融合算法、增添复杂运动感测功能，以及以单一封装替代多个分立元器件的需求。此装置的目标市场涵盖机器人、游戏、遥控器、导航系统、无人机，以及用于物联网项目的人机接口设备。
Bosch Sensortec的应用特定型ASSN（传感器节点）系列的全新传感器将加速度计、陀螺仪、磁力计与Atmel的SAMD20微控制器系列的Cortex M0+处理器相结合。在紧凑的5.2 x 3.8 x 1.1 mm单独封装中，这一装置通过“一站式”解决方案提供高级别功能，令客户可以更加简便地进行集成。
Bosch Sensortec为BMF055提供了一款软件开发包，其中包含一个带有集成指南的预编译BSX Lite融合库、用于单独传感器的API源文件，以及作为Atmel Studio插件的示例项目。Atmel工具链可于Atmel网站下载。此软件开发包将令客户能够简便地为BMF055传感器开发自主应用特定型固件，而无需额外的应用处理器。
本报告介绍对BMF055进行详细的结构、工艺、材料和成本分析。
BMF055内部MEMS芯片及梳齿结构
报告目录：
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Physical analysis- Physical analysis methodology? Package- Package characteristics: view, dimensions, and opening- Package cross-section? ASIC Dies- View, dimensions, and markings- Delayering and main blocks ID- Cross-section- Process characteristics? MEMS Dies- View, dimensions, and markings- Bond pad opening and bond pad- MEMS cap removed and details- Sensing area details- MEMS cross-section- MEMS process characteristics? MCU Die- View, dimensions, and markings- Delayering and main blocks ID- Process and die cross-section- Die process characteristics? Magnetometer Die- View, dimensions, and markings- Hall sensor and fluxgate sensor- Delayering and main blocks ID- Process and die cross-section- Die process characteristics
Manufacturing Process Flow? Global overview? ASIC front-end process? MEMS process flow? Magnetometer process flow? ASIC, MEMS, and MCU wafer fabrication unit? Packaging process flow and assembly unit
Cost Analysis? Main steps of economic analysis? Yields hypotheses? ASIC & MCU front-end cost? ASIC & MCU back-end 0: probe test and dicing? ASIC & MCU wafer & die cost? MEMS front-end cost? MEMS front-end cost per process steps? MEMS back-end 0: probe test and dicing? MEMS wafer and die cost? Magnetometer CMOS front-end cost? Magnetometer sensor cost? Magnetometer sensor cost per process steps? Magnetometer back-end 0: probe test and dicing? Magnetometer wafer and die cost? Back-end: packaging cost? Back-end: packaging cost per process steps? Back-end: final test cost? Component cost and price
Cost & price comparison with InvenSense ICM-30630 6-Axis Sensor Hub
