CUSTOMER PRODUCT SPECIFICATION

A. Technical Details 1) Material a) Body PA 6 (Polyamide 6) b) O-ring CR (Chloroprene Rubber) 2) Color a) Gray, RAL 7001 b) Black, RAL 9005 3) Flammability a) V2 (According to UL94) 4) Temperature Rating a) Permanent -20°C to +100°C b) Intermittent -30°C to +150°C 5) Thread Type a) Me

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ALPHAWIRE

EATX Motherboard with Dual Socket E supports Dual 4th Gen Intel® Xeon® Scalable Processors

Features • 2 x Intel LGA4677 Sockets support 2 x 4th Gen Intel® Xeon® Scalable Processor up to 250W TDP • Intel® C741 Chipset • 12 x DDR5 4800/4400MHz RDIMM up to 3TB • IPMI 2.0 supported by AST 2600 BMC controller onboard • 1 x Intel® I210-AT 1GbE and 1 x Intel® I226-LM 2.5GbE Ethernet Control

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BCM

Server Class ATX Motherboard LGA 4677 Socket supports 4th Gen. Intel® Xeon® Scalable Processor

Features • Intel® LGA4677 Socket supports 4th Gen Intel Xeon Scalable Processor up to 250W TDP • Intel® C741 Chipset • 6 x DDR5 slots support 4800MT/s RDIMM up to 1.5TB • TPM 2.0 onboard • IPMI 2.0 supported by AST 2600 BMC controller onboard • 1 x Intel® I210-AT 1GbE and 1 x Intel® I226-LM 2.5G

文件：1.31029 Mbytes 页数：2 Pages

BCM

Server Class ATX Motherboard LGA 4677 Socket supports 4th Gen. Intel® Xeon® Scalable Processor

Features • Intel® LGA4677 Socket supports 4th Gen Intel Xeon Scalable Processor up to 250W TDP • Intel® C741 Chipset • 6 x DDR5 slots support 4800MT/s RDIMM up to 1.5TB • TPM 2.0 onboard • IPMI 2.0 supported by AST 2600 BMC controller onboard • 1 x Intel® I210-AT 1GbE and 1 x Intel® I226-LM 2.5G

文件：1.31029 Mbytes 页数：2 Pages

BCM

Server Class ATX Motherboard LGA 4677 Socket supports 4th Gen. Intel® Xeon® Scalable Processor

Features • Intel® LGA4677 Socket supports 4th Gen Intel Xeon Scalable Processor up to 250W TDP • Intel® C741 Chipset • 6 x DDR5 slots support 4800MT/s RDIMM up to 1.5TB • TPM 2.0 onboard • IPMI 2.0 supported by AST 2600 BMC controller onboard • 1 x Intel® I210-AT 1GbE and 1 x Intel® I226-LM 2.5G

文件：1.31029 Mbytes 页数：2 Pages

BCM

Silicon Bipolar RFIC 900 MHz Vector Modulator

Description Hewlett Packard’s HPMX-2003 is a Silicon RFIC direct conversion vector modulator designed for use at output frequencies between 800␣ MHz and 1 GHz. Housed in a SO-16 surface mount plastic package, the IC contains two matched Gilbert cell mixers, an RC phase shifter, a summer, and an o

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HP

安捷伦

Silicon Bipolar RFIC 100 MHz Vector Modulator

Description Hewlett Packard’s HPMX-2005 is a silicon RFIC vector modulator housed in a SO-16 surface mount plastic package. This IC can be used for direct modulation at output frequencies from 25 to 250␣ MHz, or, in combination with an up-converting mixer, for dual or multiple conversion modulati

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HP

安捷伦

0.8 - 2.5 GHz Upconverter/Amplifier

Description The HPMX-2006 upconverter/amplifier IC is designed to meet the needs of cellular and PCS telephone and wireless LAN applications. Features • Wide Band Operation RF Output: 800-2500 MHz IF Input: DC-900 MHz • 2.7- 5.5 V Operation • Mixer + Amplifier: 38 mA Mixer only: 15 mA Standby

文件：91.81 Kbytes 页数：8 Pages

HP

安捷伦

0.8 - 2.5 GHz Upconverter/Amplifier

Description The HPMX-2006 upconverter/amplifier IC is designed to meet the needs of cellular and PCS telephone and wireless LAN applications. Features • Wide Band Operation RF Output: 800-2500 MHz IF Input: DC-900 MHz • 2.7- 5.5 V Operation • Mixer + Amplifier: 38 mA Mixer only: 15 mA Standby

文件：91.81 Kbytes 页数：8 Pages

HP

安捷伦

0.8 - 2.5 GHz Upconverter/Amplifier

Description The HPMX-2006 upconverter/amplifier IC is designed to meet the needs of cellular and PCS telephone and wireless LAN applications. Features • Wide Band Operation RF Output: 800-2500 MHz IF Input: DC-900 MHz • 2.7- 5.5 V Operation • Mixer + Amplifier: 38 mA Mixer only: 15 mA Standby

文件：91.81 Kbytes 页数：8 Pages

HP

安捷伦