HPM-SRSUAL中文资料BCM数据手册PDF规格书

特性 Features

• Intel® LGA4677 Socket supports 4th Gen Intel Xeon Scalable

Processor up to 250W TDP • Intel® C741 Chipset • 6 x DDR5 slots support 4800MT/s RDIMM up to 1.5TB • TPM 2.0 onboard • IPMI 2.0 supported by AST 2600 BMC controller onboard • 1 x Intel® I210-AT 1GbE and 1 x Intel® I226-LM 2.5GbE Ethernet

Controllers, 2 x RJ45 LAN ports • Optional 1 x Intel® X550-AT2 10GbE Ethernet Controller suppports

2 x RJ45 LAN ports, 10GbE each port • 5 x SATA III (SATA 1~4 support RAID 0, 1, 5, 10) • 1 x Internal RS232 port • 4 x USB 3.2 Gen1 port & 2 x USB 2.0 port at Edge I/O • 4 x Internal USB 3.2 Gen1 Ports • 1 x M.2 M-Key SATA/PCIe 3.0 x4 NVMe SSD, 2242/2260/2280/22110

Form Factor • 2.554mm PCB Thickness