HPM-SRSDE中文资料BCM数据手册PDF规格书

特性 Features

• 2 x Intel LGA4677 Sockets support 2 x 4th Gen Intel® Xeon® Scalable

Processor up to 250W TDP • Intel® C741 Chipset • 12 x DDR5 4800/4400MHz RDIMM up to 3TB • IPMI 2.0 supported by AST 2600 BMC controller onboard • 1 x Intel® I210-AT 1GbE and 1 x Intel® I226-LM 2.5GbE Ethernet

Controller • Optional 1 x Intel® X550-AT2 10GbE 2-Ports Ethernet Controller • 5 x SATA III support RAID 0, 1, 5, 10 • 3 x Slim SAS 8i (SFF-8654) connectors • 1 x COM port • 6 x USB 3.2 Gen 1 Edge I/O • 2 x Internal USB 3.2 Gen 1 & 2 x USB 2.0 Type A • 1 x M.2 M-Key PCIe 5.0 x4 NVMe SSD, 2242/2260/2280/22110 • TPM 2.0 onboard • Supports Windows IoT Enterprise/Server IoT • PCB thickness 2.86mm