丝印：GS1G；Package：SMAF-C；Surface Mount General Purpose Rectifier

Features  Glass passivated chip junction  Low forward voltage drop  Low leakage current  AEC-Q101 qualified  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

文件：323.43 Kbytes 页数：4 Pages

PANJIT

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丝印：GS1GB；Package：DO-214AA；Surface Mount General Purpose Rectifier GS1AB Through GS1MB

FEATUR E S ● Low profile package ● Ideal for automated placement ● Glass passivated chip junction ● High forward surge capability ● Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

文件：1.17976 Mbytes 页数：3 Pages

RFE

RFE international

丝印：GS1J；Package：SMAF-C；Surface Mount General Purpose Rectifier

Features  Glass passivated chip junction  Low forward voltage drop  Low leakage current  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

文件：343.66 Kbytes 页数：4 Pages

PANJIT

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丝印：GS1J；Package：SMAF-C；Surface Mount General Purpose Rectifier

Features  Glass passivated chip junction  Low forward voltage drop  Low leakage current  AEC-Q101 qualified  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

文件：323.43 Kbytes 页数：4 Pages

PANJIT

強茂

丝印：GS1JB；Package：DO-214AA；Surface Mount General Purpose Rectifier GS1AB Through GS1MB

FEATUR E S ● Low profile package ● Ideal for automated placement ● Glass passivated chip junction ● High forward surge capability ● Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

文件：1.17976 Mbytes 页数：3 Pages

RFE

RFE international

丝印：GS1K；Package：SMAF-C；Surface Mount General Purpose Rectifier

Features  Glass passivated chip junction  Low forward voltage drop  Low leakage current  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

文件：343.66 Kbytes 页数：4 Pages

PANJIT

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丝印：GS1K；Package：SMAF-C；Surface Mount General Purpose Rectifier

Features  Glass passivated chip junction  Low forward voltage drop  Low leakage current  AEC-Q101 qualified  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

文件：323.43 Kbytes 页数：4 Pages

PANJIT

強茂

丝印：GS1KB；Package：DO-214AA；Surface Mount General Purpose Rectifier GS1AB Through GS1MB

FEATUR E S ● Low profile package ● Ideal for automated placement ● Glass passivated chip junction ● High forward surge capability ● Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

文件：1.17976 Mbytes 页数：3 Pages

RFE

RFE international

丝印：GS1M；Package：SMAF-C；Surface Mount General Purpose Rectifier

Features  Glass passivated chip junction  Low forward voltage drop  Low leakage current  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

文件：343.66 Kbytes 页数：4 Pages

PANJIT

強茂

丝印：GS1M；Package：SMAF-C；Surface Mount General Purpose Rectifier

Features  Glass passivated chip junction  Low forward voltage drop  Low leakage current  AEC-Q101 qualified  Lead free in compliance with EU RoHS 2.0  Green molding compound as per IEC 61249 standard

文件：323.43 Kbytes 页数：4 Pages

PANJIT

強茂