丝印：G2DF；Package：SMAF；Surface Mount Tension Resolution G2AF Through G2MF

FEATURES ● Low profile package ● Ideal for automated placement ● Glass passivated chip junction ● High forward surge capability ● Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

文件：1.55975 Mbytes 页数：3 Pages

RFERFE international

RFE国际公司RFE国际股份有限公司

丝印：G2DF；Package：SMAF；Surface Mount Tension Resolution G2AF Through G2MF

FEATURES ● Low profile package ● Ideal for automated placement ● Glass passivated chip junction ● High forward surge capability ● Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

文件：1.55975 Mbytes 页数：3 Pages

RFERFE international

RFE国际公司RFE国际股份有限公司

丝印：G2D；SURFACE MOUNT SILICON RECTIFIERS

文件：85.2 Kbytes 页数：3 Pages

MIC

昌福电子