FF600R12IP4P

PrimePACK™2 Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled Diode und bereits aufgetragenem Thermal Interface Material

ElectricalFeatures •Highshort-circuitcapability •Highsurgecurrentcapability •Highcurrentdensity •Tvjop=150°C •VCEsatwithpositivetemperaturecoefficient MechanicalFeatures •4kVAC1mininsulation •PackagewithCTI>400 •Highcreepageandclearancedistances •In

FF600R12IP4P

IGBT 模块; \n优势:\n• High power density\n• Standardized housing\n;

FF600R12IP4PBPSA1

Package：模块；包装：托盘 类别：分立半导体产品 晶体管 - IGBT - 模块 描述：PP IHM I XHP 1 7KV AG-PRIME2-411

DF600R12IP4D

PrimePACK??ModulmitTrench/FeldstoppIGBT4,gr철횩ererEmitterControlled4Diode

FD600R12IP4D

PrimePACK2ModulmitTrench/FeldstoppIGBT4,grobererEmitterControlled4DiodeandNTC

FF600R12IP4

EvaluationDriverBoardfor1200VPrimePACK™

1Introduction The2ED250E12-FevaluationdriverboardshowninFig.1wasdevelopedtosupportcustomersduringtheir firstdesignstepswiththe1200VPrimePACK™IGBTmodule.Theevaluationdriverboardisafully functionalIGBTmoduledriverwheretwo1ED020I12-FdriverICprocesscontrola

FF600R12IP4

PrimePACK2ModulmitTrench

FF600R12IP4

PrimePACK??ModulmitTrench/FieldstoppIGBT4undEmitterControlled4DiodeundNTC

FF600R12IP4V

PrimePACK™2modulewithTrench/FieldstopIGBT4andEmitterControlled4diodeandNTC

ElectricalFeatures •ExtendedOperationTemperatureTvjop •HighDCStability •HighShortCircuitCapability,SelfLimitingShort CircuitCurrent •LowVCEsat •UnbeatableRobustness •VCEsatwithpositiveTemperatureCoefficient MechanicalFeatures •4kVAC1minInsulation •Packag