D10

Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION MemoryCardsconsistoftwomainparts:theplasticcard,andtheembeddedMicromodule(which,inturn,carriesthesiliconchip). ■Micromodulesweredevelopedspecificallyfor embeddinginSmartcardsandMemoryCards ■TheMicromoduleprovides: –Supportforthechi

D10

Premium Point Source

Keyfeatures Premium10”Loudspeaker 다른색채가가미되지않은원음재생을위한DriverUnit사용(B&C) 높은명료성을위한CMD(ConstantMatchingDesign)기술의 Waveguide설계 다양한각도에서스피커를사용하기위해RotatableHorn적용 (90˚Hx60˚V) 스테이지모니터사용가능한Enclosure디자인 Ceiling및Wallrigging을위한M8suspensionpoints 15mmAllbirc

D10

Single-In-Line Conformal Coated Diode Array

4to14Leads Standardandcustomcircuits Spacesavingdesign

D10

D10 Expert?™? Dual Discrete Outputs

D10

Analog and Discrete Outputs

D10

D10 Expert??Series with Bar Graph Display and Discrete Output

D10

D10?봁iscrete Output

D10

包装：散装 类别：工具 插拔工具 描述：DIE FOR R31 SOCKETPINS USE P158V

D10/CRCW0402

Standard Thick Film Chip Resistors

FEATURES ●StabilityΔR/R=1for1000hat70°C ●2mmpitchpackagingoptionfor0603size ●PuretinsoldercontactsonNibarrierlayerprovidescompatibilitywithlead(Pb)-freeandleadcontainingsolderingprocesses ●Metalglazeonhighqualityceramic ●AEC-Q200qualified ●Mater

D10/CRCW0402

Lead (Pb)-Bearing Thick Film, Rectangular Chip ResistorsS

FEATURES •StabilityΔR/R=1for1000hat70°C •Lead(Pb)-bearingterminationplatingonNibarrierlayer •Metalglazeonhighqualityceramic •Halogen-freeaccordingtoIEC61249-2-21definiton •AEC-Q200qualified,rev.Ccompliant