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D10中文资料意法半导体数据手册PDF规格书

厂商型号	D10
功能描述	Memory Micromodules General Information for D1, D2 and C Packaging
文件大小	277.48 Kbytes
页面数量	13 页
生产厂商	STMICROELECTRONICS
中文名称	意法半导体
网址	网址
数据手册	下载地址一下载地址二到原厂下载
更新时间	2026-1-30 17:41:00
人工找货	D10价格和库存，欢迎联系客服免费人工找货

DESCRIPTION

Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip).

■ Micromodules were developed specifically for

embedding in Smartcards and Memory Cards

■ The Micromodule provides:

– Support for the chip

– Electrical contacts

– Suitable embedding interface for gluing the

module to the plastic package

■ Physical dimensions and contact positions

compliant to the ISO 7816 standard

■ Micromodules delivered as a continuous Super

35 mm tape. (This differs from the standard

35 mm tape in the spacing distance between

the indexing holes.)

型号：
D10
功能描述：
DIE FOR R31 SOCKETPINS USE P158V
RoHS：
是
类别：
工具 >> 插入，抽取
系列：
R31
标准包装：
1
系列：
*
其它名称：
0011-03-00080011-03-0008-E00110300080011030008-E11-03-0008-E1103000811030008-EQ4729393AT0980176A