CC2674P10中文资料具有 1MB 闪存和功率放大器的 SimpleLink™ Arm® Cortex®-M33 多协议 2.4GHz 无线 MCU数据手册TI规格书

描述 Description

The SimpleLink™ CC2674P10 device is a multiprotocol and multi-band 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, and home theater & entertainment markets. The highlighted features of this device include: Arm TrustZone based secure key storage, device ID and trusted functions support. Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK). Longer battery life wireless applications with low standby current of 0.92 µA with full 256 kB RAM retention. Enablement of long-range and low-power applications using integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 101 mA for 2.4 GHz operation. Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events. Dedicated software controlled radio controller (Arm ® Cortex ®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards. Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-105 dBm for 125 kbps LE Coded PHY).

The CC2674P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs 2.4 GHz solutions, visit www.ti.com/bluetooth

特性 Features

Wireless microcontroller
• FPU and DSP extension
• 8 kB of cache SRAM
• ­32 kB of additional SRAM is available if parity is disabled
• Dynamic multiprotocol manager (DMM) driver
• Supports over-the-air upgrade (OTA)
• Autonomous MCU with 4 kB of SRAM
• Fast wake-up for low-power operation
• MCU consumption:
• 83 µA/MHz running CoreMark
• 0.13 µA shutdown mode, wake-up on pin
• Ultra low-power sensor controller consumption:
• 809 µA in 24 MHz mode
• Radio consumption:
• 22 mA TX at +10 dBm at 2.4 GHz
• 7.3 mA TX at 0 dBm at 2.4 GHz
• Thread, Zigbee®, Matter
• 6LoWPAN
• –104 dBm for Bluetooth® Low Energy 125 kbps
• Output power up to +20 dBm with temperature compensation
• Designed for systems targeting compliance with these standards:
• FCC CFR47 Part 15
• Most digital peripherals can be routed to any GPIO
• 12-bit SAR ADC, 200 ksps, 8 channels
• Two comparators
• Four UART, four SPI, two I 2C, I 2S
• Integrated temperature and battery monitor
• Supports secure boot
• Arm TrustZone for trusted execution environment
• Public key accelerator
• True random number generator (TRNG)
• Software anti-rollback protection
• LP-EM-CC1354P10-6 for dual-band and 10 dBm output power on 2.4 GHz
• SimpleLink™ LOWPOWER F2 Software Development Kit (SDK)
• Sensor Controller Studio for building low-power sensing applications
• On-chip buck DC/DC converter
• –40°C to +105°C
• 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)
• RoHS-compliant package

Information for the RSK package (8.00 mm x 8.00 mm) is preview only and subject to change.