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CC2674P10

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TITexas Instruments

德州仪器美国德州仪器公司

CC2674P10

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674P10

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674P10

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674P10

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674P10

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674P10

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674P10

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

CC2674P10

具有 1MB 闪存和功率放大器的 SimpleLink™ Arm® Cortex®-M33 多协议 2.4GHz 无线 MCU; Wireless microcontroller \n• Powerful 48 MHz Arm Cortex-M33 processor with TrustZone \n• FPU and DSP extension\n• 1024 kB flash program memory\n• 8 kB of cache SRAM\n• 256 kB of ultra-low leakage SRAM with parity for high-reliability operation \n• ­32 kB of additional SRAM is available if parity is disabled\n \n• Dynamic multiprotocol manager (DMM) driver\n• Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.3 Low Energy, IEEE 802.15.4 PHY and MAC \n• Supports over-the-air upgrade (OTA)\n Ultra-low power sensor controller \n• Autonomous MCU with 4 kB of SRAM\n• Sample, store, and process sensor data\n• Fast wake-up for low-power operation\n• Software defined peripherals; capacitive touch, flow meter, LCD\n Low power consumption \n• MCU consumption: \n• 4.0 mA active mode, CoreMark \n• 83 µA/MHz running CoreMark\n• 1.19 µA standby mode, RTC, 256 kB RAM\n• 0.13 µA shutdown mode, wake-up on pin\n \n• Ultra low-power sensor controller consumption: \n• 30 µA in 2 MHz mode\n• 809 µA in 24 MHz mode\n \n• Radio consumption: \n• 6.4 mA RX at 2.4 GHz\n• 22 mA TX at +10 dBm at 2.4 GHz\n• 101 mA TX at +20 dBm at 2.4 GHz\n• 7.3 mA TX at 0 dBm at 2.4 GHz\n \n Wireless protocol support \n• Thread, Zigbee®, Matter \n• Bluetooth® 5.3 Low Energy\n• 6LoWPAN\n• Proprietary Systems \n High performance radio \n• –104 dBm for Bluetooth® Low Energy 125 kbps\n• –105 dBm for IEEE 802.15.4-2006 2.4 GHz OQPSK (coherent modem)\n• Output power up to +20 dBm with temperature compensation\n Regulatory compliance \n• Designed for systems targeting compliance with these standards: \n• EN 300 328, EN 300 440 Cat. 2 and 3\n• FCC CFR47 Part 15\n• ARIB STD-T66\n \n MCU peripherals \n• Most digital peripherals can be routed to any GPIO\n• Four 32-bit or eight 16-bit general-purpose timers\n• 12-bit SAR ADC, 200 ksps, 8 channels\n• 8-bit DAC\n• Two comparators\n• Programmable current source\n• Four UART, four SPI, two I 2C, I 2S\n• Real-time clock (RTC)\n• Integrated temperature and battery monitor\n Security enablers \n• Supports secure boot\n• Supports secure key storage and device ID\n• Arm TrustZone for trusted execution environment\n• AES 128- and 256-bit cryptographic accelerator\n• Public key accelerator\n• SHA2 accelerator (full suite up to SHA-512)\n• True random number generator (TRNG)\n• Secure debug lock\n• Software anti-rollback protection\n Development tools and software \n• LP-EM-CC1354P10-6 for dual-band and 10 dBm output power on 2.4 GHz \n• LP-XDS110, LP-XDS110ET or TMDSEMU110-U (with TMDSEMU110-ETH add-on) Debug Probe\n• SimpleLink™ LOWPOWER F2 Software Development Kit (SDK) \n• SmartRF™ Studio for simple radio configuration \n• Sensor Controller Studio for building low-power sensing applications \n• SysConfig system configuration tool\n Operating range \n• On-chip buck DC/DC converter\n• 1.8 V to 3.8 V single supply voltage\n• –40°C to +105°C \n Package \n• 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)\n• 8 mm × 8 mm RSK VQFN64 (42 GPIOs)\n \n• RoHS-compliant package\n \nInformation for the RSK package (8.00 mm x 8.00 mm) is preview only and subject to change.;

The SimpleLink™ CC2674P10 device is a multiprotocol and multi-band 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.3 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, and home theater & entertainment markets. The highlighted features of this device include: Arm TrustZone based secure key storage, device ID and trusted functions support. Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK). Longer battery life wireless applications with low standby current of 0.92 µA with full 256 kB RAM retention. Enablement of long-range and low-power applications using integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 101 mA for 2.4 GHz operation. Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events. Dedicated software controlled radio controller (Arm ® Cortex ®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards. Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-105 dBm for 125 kbps LE Coded PHY). \n\nThe CC2674P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU platform.\n\nIn addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs 2.4 GHz solutions, visit www.ti.com/bluetooth

TITexas Instruments

德州仪器美国德州仪器公司

CC2674P10_V01

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments

德州仪器美国德州仪器公司

技术参数

  • Type:

    Wireless MCU

  • Features:

    15.4G PHY

  • Peripherals:

    12-bit ADC 8-channel

  • Rating:

    Catalog

  • Flash memory (kByte):

    1024

  • RAM (kByte):

    296

  • Number of GPIOs:

    42

  • Security:

    Cryptographic acceleration

  • Sensitivity (best) (dBm):

    -103

  • Operating temperature range (°C):

    -40 to 105

  • 封装:

    VQFN (RGZ)

  • 引脚:

    48

  • 尺寸:

    49 mm² 7 x 7

供应商型号品牌批号封装库存备注价格
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
TI/德州仪器
25+
原厂封装
9999
询价
TI/德州仪器
25+
原厂封装
10280
询价
AVASEM
24+
DIP40
500000
行业低价,代理渠道
询价
Y&Y
两年内
NA
1015
实单价格可谈
询价
TI/德州仪器
23+
SOP8
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
TI
2023+
8700
原装现货
询价
TUSONIX
10
全新原装 货期两周
询价
KINGBRIGHT
23+
NA
19960
只做进口原装,终端工厂免费送样
询价
LAIRD
2447
SMD
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
更多CC2674P10供应商 更新时间2025-7-28 15:20:00