丝印：CC1350F128；Package：VQFN(RSM)；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件：3.41582 Mbytes 页数：76 Pages

TI

德州仪器

丝印：CC1350F128；Package：VQFN(RSM)；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件：3.41582 Mbytes 页数：76 Pages

TI

德州仪器

丝印：CC1350F128；Package：VQFN(RSM)；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件：3.41582 Mbytes 页数：76 Pages

TI

德州仪器

丝印：CC1350F128；Package：VQFN(RSM)；CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件：3.41582 Mbytes 页数：76 Pages

TI

德州仪器

丝印：CC1354P106；Package：VQFN；CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件：3.59194 Mbytes 页数：91 Pages

TI

德州仪器

丝印：CC1354P106；Package：VQFN；CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件：3.59194 Mbytes 页数：91 Pages

TI

德州仪器

丝印：CC1354R106；Package：VQFN；CC1354R10 SimpleLink™ High-Performance Multiband Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

文件：3.59657 Mbytes 页数：86 Pages

TI

德州仪器

丝印：CC1354R106；Package：VQFN；CC1354R10 SimpleLink™ High-Performance Multiband Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

文件：3.59657 Mbytes 页数：86 Pages

TI

德州仪器

丝印：CC1310F128；Package：VQFN；SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件：1.47595 Mbytes 页数：54 Pages

TI

德州仪器

丝印：CC1310F128；Package：VQFN；SimpleLink Ultralow Power Sub-1-GHz Wireless MCU

文件：1.47595 Mbytes 页数：54 Pages

TI

德州仪器