CC1312R技术资料参数批发采购德州仪器第7页-114ic电子网

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型号	下载订购	功能描述	制造商上传企业	LOGO
CC1310F64RHBT	文件：3.33512 Mbytes Page：72 Pages	丝印：CC1310F64；Package：VQFN(RHB)；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka 文件：3.33512 Mbytes 页数：72 Pages	TI 德州仪器	TI
CC1310F64RHBT.B	文件：3.33512 Mbytes Page：72 Pages	丝印：CC1310F64；Package：VQFN(RHB)；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka 文件：3.33512 Mbytes 页数：72 Pages	TI 德州仪器	TI
CC1310F64RSM	文件：3.33512 Mbytes Page：72 Pages	CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka 文件：3.33512 Mbytes 页数：72 Pages	TI 德州仪器	TI
CC1310F64RSMR	文件：3.33512 Mbytes Page：72 Pages	丝印：CC1310F64；Package：VQFN(RSM)；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka 文件：3.33512 Mbytes 页数：72 Pages	TI 德州仪器	TI
CC1310F64RSMR.B	文件：3.33512 Mbytes Page：72 Pages	丝印：CC1310F64；Package：VQFN(RSM)；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka 文件：3.33512 Mbytes 页数：72 Pages	TI 德州仪器	TI
CC1310F64RSMT	文件：3.33512 Mbytes Page：72 Pages	丝印：CC1310F64；Package：VQFN(RSM)；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka 文件：3.33512 Mbytes 页数：72 Pages	TI 德州仪器	TI
CC1310F64RSMT.B	文件：3.33512 Mbytes Page：72 Pages	丝印：CC1310F64；Package：VQFN(RSM)；CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka 文件：3.33512 Mbytes 页数：72 Pages	TI 德州仪器	TI
CC1311P3	文件：2.60305 Mbytes Page：59 Pages	CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 文件：2.60305 Mbytes 页数：59 Pages	TI 德州仪器	TI
CC1311P3	文件：3.50774 Mbytes Page：64 Pages	CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU 1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3 文件：3.50774 Mbytes 页数：64 Pages	TI 德州仪器	TI
CC1311P3	文件：3.96385 Mbytes Page：75 Pages	CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier 1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis 文件：3.96385 Mbytes 页数：75 Pages	TI 德州仪器	TI

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技术参数

Frequency bands (MHz)：
143-176
TX power (Max) (dBm)：
14
RAM (KB)：
80
Sensitivity (best) (dBm)：
-121
GPIO：
30
RX current (lowest) (mA)：
5.8
Data rate (Max) (kbps)：
4000
Rating：
Catalog
Operating temperature range (C)：
-40 to 105

供应商	型号	品牌	批号	封装	库存	备注	价格
深圳市华睿芯科技有限公司	CC1312R1F3RGZT	Texas Instruments	24+	VQFN-48	3265	全新原厂原装，进口正品现货，正规渠道可含税！！	询价
中天科工半导体（深圳）有限公司	CC1312R1F3RGZT	Texas Instruments	20+	VQFN-48	29860	TI微控制器MCU-可开原型号增税票	询价
艾睿（深圳）半导体有限公司	CC1312R1F3RGZT	TI(德州仪器)	2447	VQFN-48(7x7)	315000	250个/圆盘一级代理专营品牌!原装正品,优势现货,长	询价
讯运(深圳/上海)电子有限公司	CC1312R1F3RGZT	TI(德州仪器)	2021+	VQFN-48(7x7)	499		询价
深圳市正纳电子有限公司	CC1312R1F3RGZ	NA	23+	NA	26094	10年以上分销经验原装进口正品,做服务型企业	询价
深圳市联世界科技有限公司	CC1312R1F3RGZR	TI(德州仪器)	24+/25+		10000	原装正品现货库存价优	询价
深圳市威尔健半导体有限公司	CC1312R1F3RGZR	TI/德州仪器	23+	VQFN48	50000	全新原装正品现货,支持订货	询价
深圳市安富世纪电子有限公司	CC1312R1F3RGZR	TI	23+	QFN48	50000	全新原装正品现货,支持订货	询价
深圳市河锋鑫科技有限公司	CC1312R1F3RGZR				80000		询价
深圳市鑫炜纳电子有限公司	CC1312R1F3RGZR	TI(德州仪器)	2022+		8000	原厂原装,假一罚十	询价

更多CC13供应商更新时间2026-3-12 19:00:00

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