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CC1350F128RGZR

丝印:CC1350F128;Package:VQFN(RGZ);CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件:3.41582 Mbytes 页数:76 Pages

TI

德州仪器

CC1350F128RGZR.B

丝印:CC1350F128;Package:VQFN(RGZ);CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件:3.41582 Mbytes 页数:76 Pages

TI

德州仪器

CC1350F128RGZT

丝印:CC1350F128;Package:VQFN(RGZ);CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件:3.41582 Mbytes 页数:76 Pages

TI

德州仪器

CC1350F128RGZT.B

丝印:CC1350F128;Package:VQFN(RGZ);CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件:3.41582 Mbytes 页数:76 Pages

TI

德州仪器

CC1350F128RHBR

丝印:CC1350F128;Package:VQFN(RHB);CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件:3.41582 Mbytes 页数:76 Pages

TI

德州仪器

CC1350F128RHBR.B

丝印:CC1350F128;Package:VQFN(RHB);CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件:3.41582 Mbytes 页数:76 Pages

TI

德州仪器

CC1350F128RHBT

丝印:CC1350F128;Package:VQFN(RHB);CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件:3.41582 Mbytes 页数:76 Pages

TI

德州仪器

CC1350F128RHBT.B

丝印:CC1350F128;Package:VQFN(RHB);CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件:3.41582 Mbytes 页数:76 Pages

TI

德州仪器

CC1350F128RSMR

丝印:CC1350F128;Package:VQFN(RSM);CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件:3.41582 Mbytes 页数:76 Pages

TI

德州仪器

CC1350F128RSMR.B

丝印:CC1350F128;Package:VQFN(RSM);CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU

1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.4 GHz) Wireless Microcontroller • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 128KB of In-System Programmable Flash – 8KB of SRAM for C

文件:3.41582 Mbytes 页数:76 Pages

TI

德州仪器

供应商型号品牌批号封装库存备注价格
TI/德州仪器
25+
原厂封装
10000
询价
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
TI/德州仪器
25+
原厂封装
9999
询价
TI/德州仪器
25+
原厂封装
10280
询价
TI(德州仪器)
25+
封装
500000
源自原厂成本,高价回收工厂呆滞
询价
TI德州仪器
22+
24000
原装正品现货,实单可谈,量大价优
询价
TI/德州仪器
25+
VQFN-48
8880
原装认准芯泽盛世!
询价
TI/德州仪器
21+
VQFN-48
9990
只有原装
询价
TI/德州仪器
20+
VQFN-48
5000
原厂原装订货诚易通正品现货会员认证企业
询价
TI/德州仪器
21+
VQFN-48
9990
只有原装
询价
更多CC13供应商 更新时间2025-12-17 13:33:00