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CC1310F64RHBR

丝印:CC1310F64;Package:VQFN(RHB);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F64RHBR.B

丝印:CC1310F64;Package:VQFN(RHB);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F64RHBT

丝印:CC1310F64;Package:VQFN(RHB);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F64RHBT.B

丝印:CC1310F64;Package:VQFN(RHB);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F64RSMR

丝印:CC1310F64;Package:VQFN(RSM);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F64RSMR.B

丝印:CC1310F64;Package:VQFN(RSM);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F64RSMT

丝印:CC1310F64;Package:VQFN(RSM);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1310F64RSMT.B

丝印:CC1310F64;Package:VQFN(RSM);CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1.1 Features 1 • Microcontroller – Powerful Arm® Cortex®-M3 Processor – EEMBC CoreMark® Score: 142 – EEMBC ULPBench™ Score: 158 – Clock Speed up to 48-MHz – 32KB, 64KB, and 128KB of In-System Programmable Flash – 8KB of SRAM for Cache (or as General-Purpose RAM) – 20KB of Ultra-Low-Leaka

文件:3.33512 Mbytes 页数:72 Pages

TI

德州仪器

CC1312PSIPMOTR

丝印:CC1312P;Package:QFM;CC1312PSIP SimpleLink™ Sub-1-GHz Wireless System-in-Package

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Programmable radio includes sup

文件:2.21981 Mbytes 页数:80 Pages

TI

德州仪器

CC1312R1F3RGZR

丝印:CC1312R1F3;Package:VQFN(RGZ);CC1312R SimpleLink™ High-Performance Sub-1 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48-MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352KB of in-system programmable flash – 256KB of ROM for protocols and library functions – 8KB of cache SRAM (alternatively available as general-purpose RAM) – 80KB of ultra-low leakag

文件:2.76987 Mbytes 页数:79 Pages

TI

德州仪器

供应商型号品牌批号封装库存备注价格
TI/德州仪器
25+
原厂封装
10000
询价
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
TI/德州仪器
25+
原厂封装
9999
询价
TI/德州仪器
25+
原厂封装
10280
询价
TI(德州仪器)
25+
封装
500000
源自原厂成本,高价回收工厂呆滞
询价
TI德州仪器
22+
24000
原装正品现货,实单可谈,量大价优
询价
TI/德州仪器
25+
VQFN-48
8880
原装认准芯泽盛世!
询价
TI/德州仪器
21+
VQFN-48
9990
只有原装
询价
TI/德州仪器
20+
VQFN-48
5000
原厂原装订货诚易通正品现货会员认证企业
询价
TI/德州仪器
21+
VQFN-48
9990
只有原装
询价
更多CC13供应商 更新时间2025-12-17 13:33:00