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CC1311P3

CC2674R10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.63739 Mbytes 页数:69 Pages

TI

德州仪器

CC1311P3

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4-GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.65151 Mbytes 页数:72 Pages

TI

德州仪器

CC1311P3

CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • AEC-Q100 Grade 2 qualified for Automotive applications • Optimized 48-MHz Arm® Cortex®-M0+ processor • 512 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mod

文件:2.21766 Mbytes 页数:63 Pages

TI

德州仪器

CC1311P3

CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48 MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024 kB flash program memory • 8 kB of cache SRAM • 256 kB of ultra-low leakage SRAM with parity for high-reliability operation – 32 kB of additional SRAM is availabl

文件:3.59194 Mbytes 页数:91 Pages

TI

德州仪器

CC1311P3

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:2.60305 Mbytes 页数:59 Pages

TI

德州仪器

CC1311P3

CC2340R2 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

1 Features Wireless microcontroller • Optimized 48-MHz Arm® Cortex®-M0+ processor • 256 KB of in-system programmable flash • 12 KB of ROM for bootloader and drivers • 28 KB of ultra-low leakage SRAM. Full RAM retention in standby mode • 2.4 GHz RF transceiver compatible with Bluetooth® 5.3

文件:3.50774 Mbytes 页数:64 Pages

TI

德州仪器

CC1311P3

CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

文件:3.42691 Mbytes 页数:75 Pages

TI

德州仪器

CC1311P3

CC2674P10 SimpleLink™ High-Performance Multiprotocol 2.4GHz Wireless MCU with Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48MHz Arm® Cortex®-M33 processor with TrustZone® • FPU and DSP extension • 1024kB flash program memory • 8kB of cache SRAM • 256kB of ultra-low leakage SRAM with parity for high-reliability operation – 32kB of additional SRAM if parity is dis

文件:3.96385 Mbytes 页数:75 Pages

TI

德州仪器

CC1311P3

CC2642R SimpleLink™ Bluetooth ® 5.2 Low Energy Wireless MCU

1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le

文件:2.42035 Mbytes 页数:58 Pages

TI

德州仪器

CC1311P3

CC2651P3 SimpleLink™ Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • 352KB flash program memory • 32KB of ultra-low leakage SRAM • 8KB of Cache SRAM (Alternatively available as general-purpose RAM) • Programmable radio includes support for 2- (G)FSK, 4-(G)FSK, MSK, Bluetooth®

文件:3.83369 Mbytes 页数:66 Pages

TI

德州仪器

技术参数

  • TX power (Max) (dBm):

    20

  • RAM (KB):

    32

  • Peripherals:

    1 SPI

  • Sensitivity (best) (dBm):

    -121

  • GPIO:

    26

  • Data rate (Max) (kbps):

    2000

  • Rating:

    Catalog

  • Operating temperature range (C):

    -40 to 105

供应商型号品牌批号封装库存备注价格
TI德州仪器
22+
24000
原装正品现货,实单可谈,量大价优
询价
TI(德州仪器)
24+
NA/
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
Texas Instruments
2024
5000
全新、原装
询价
TI/德州仪器
25+
原厂封装
9999
询价
TI/德州仪器
25+
原厂封装
10280
询价
TI(德州仪器)
25+
VQFN(RGZ)-48
500000
源自原厂成本,高价回收工厂呆滞
询价
N/A
23+
80000
专注配单,只做原装进口现货
询价
TI/德州仪器
25+
VQFN-48
8880
原装认准芯泽盛世!
询价
TI/德州仪器
21+
VQFN-48
9990
只有原装
询价
更多CC1311P3供应商 更新时间2025-12-4 8:01:00