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CC1311P3

CC2652PSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package With Integrated Power Amplifier

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4F processor • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • Dynamic multiprotocol manager (

文件:2.9638 Mbytes 页数:72 Pages

TI

德州仪器

CC1311P3

CC2642R-Q1 SimpleLink™ Bluetooth® 5.2 Low Energy Wireless MCU

1 Features Wireless microcontroller • Powerful 48-MHz Arm® Cortex®-M4 processor • EEMBC CoreMark® score: 148 • 352KB flash program memory • 256KB of ROM for protocols and library functions • 8KB of cache SRAM • 80KB of ultra-low leakage SRAM with parity for high-reliability operation • 2-

文件:1.75855 Mbytes 页数:54 Pages

TI

德州仪器

CC1311P3

CC2652R SimpleLink™ Multiprotocol 2.4 GHz Wireless MCU

1 Features • Microcontroller – Powerful 48 MHz Arm® Cortex®-M4F processor – EEMBC CoreMark® score: 148 – 352 kB of in-system programmable flash – 256 kB of ROM for protocols and library functions – 8 kB of cache SRAM (alternatively available as general-purpose RAM) – 80 kB of ultra-low le

文件:2.44629 Mbytes 页数:61 Pages

TI

德州仪器

CC1311P3

CC1311P3 SimpleLink??High-Performance Sub-1 GHz Wireless MCU With Integrated Power Amplifier

文件:3.3882 Mbytes 页数:63 Pages

TI

德州仪器

CC1311P3

CC2651P3 SimpleLink??Single-Protocol 2.4 GHz Wireless MCU With Integrated Power Amplifier

文件:3.51768 Mbytes 页数:63 Pages

TI

德州仪器

CC1311P3

具有 352KB 闪存和集成 +20dBm PA 的 SimpleLink™ Arm® Cortex®-M4 Sub-1GHz 无线 MCU

Wireless microcontroller \n• 352KB flash program memory\n• 8KB of Cache SRAM (Alternatively available as general-purpose RAM)\n• Supports over-the-air upgrade (OTA)\n• MCU consumption: \n• 55 µA/MHz running CoreMark\n• 0.1 µA shutdown mode, wake-up on pin\n• Radio Consumption: \n• 24.9 mA TX at +14;

TI

德州仪器

CC1311P31T0RGZR

丝印:CC1311P31;Package:VQFN;CC1311P3 SimpleLink??High-Performance Sub-1 GHz Wireless MCU With Integrated Power Amplifier

文件:3.3882 Mbytes 页数:63 Pages

TI

德州仪器

CC1311P31T0RGZR

Package:48-VFQFN 裸露焊盘;包装:托盘 类别:RF/IF,射频/中频和 RFID 射频收发器 IC 描述:SIMPLELINK ARM CORTEX-M4 SUB-1 G

TI

德州仪器

技术参数

  • TX power (Max) (dBm):

    20

  • RAM (KB):

    32

  • Peripherals:

    1 SPI

  • Sensitivity (best) (dBm):

    -121

  • GPIO:

    26

  • Data rate (Max) (kbps):

    2000

  • Rating:

    Catalog

  • Operating temperature range (C):

    -40 to 105

供应商型号品牌批号封装库存备注价格
TI德州仪器
22+
24000
原装正品现货,实单可谈,量大价优
询价
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
Texas Instruments
2024
5000
全新、原装
询价
TI/德州仪器
25+
原厂封装
9999
询价
TI/德州仪器
25+
原厂封装
10280
询价
TI
25+
N/A
18746
样件支持,可原厂排单订货!
询价
TI
25+
N/A
18798
正规渠道,免费送样。支持账期,BOM一站式配齐
询价
TI(德州仪器)
25+
VQFN(RGZ)-48
500000
源自原厂成本,高价回收工厂呆滞
询价
N/A
23+
80000
专注配单,只做原装进口现货
询价
TI/德州仪器
25+
VQFN-48
8880
原装认准芯泽盛世!
询价
更多CC1311P3供应商 更新时间2026-1-27 15:01:00