丝印：97374M；Package：VSON-CLIP(DPC)；CSD97374Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode

文件：661.62 Kbytes 页数：23 Pages

TI

德州仪器

丝印：97374M；Package：VSON-CLIP；CSD97374Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode

文件：661.16 Kbytes 页数：23 Pages

TI

德州仪器

丝印：97374M；Package：VSON-CLIP(DPC)；CSD97374Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode

文件：661.62 Kbytes 页数：23 Pages

TI

德州仪器

丝印：97374M；Package：VSON-CLIP；CSD97374Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode

文件：661.16 Kbytes 页数：23 Pages

TI

德州仪器

丝印：97376M；Package：VSON-CLIP；CSD97376Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 90% System Efficiency at 15 A • Max Rated Continuous Current 20 A, Peak 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.

文件：665.23 Kbytes 页数：23 Pages

TI

德州仪器

丝印：97376M；Package：VSON-CLIP；CSD97376Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• 90% System Efficiency at 15 A • Max Rated Continuous Current 20 A, Peak 45 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode • 3.

文件：665.23 Kbytes 页数：23 Pages

TI

德州仪器

丝印：97374M；Package：SON-183,5x4,5；Synchronous Buck NexFET Power Stage

文件：931.94 Kbytes 页数：18 Pages

TI

德州仪器

丝印：97374M；Package：SON-183,5x4,5；Synchronous Buck NexFET Power Stage

文件：1.40054 Mbytes 页数：20 Pages

TI

德州仪器

丝印：97374M；Package：SON-183,5x4,5；Synchronous Buck NexFET Power Stage

文件：1.40054 Mbytes 页数：20 Pages

TI

德州仪器

包装：袋 类别：电缆，电线 - 管理 缆线固定扣 描述：M10X1.0 HP CORD GRIP EMI/RFI

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