丝印：97374M；Package：VSON-CLIP(DPC)；CSD97374Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode

文件：661.62 Kbytes 页数：23 Pages

TI

德州仪器

CSD97374Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode

文件：661.62 Kbytes 页数：23 Pages

TI

德州仪器

丝印：97374M；Package：VSON-CLIP；CSD97374Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode

文件：661.16 Kbytes 页数：23 Pages

TI

德州仪器

VSON8

TI

德州仪器

上传：深圳市亚泰盈科电子有限公司

SOP8

CHIPSEACore Technology (Shenzhen) Co., Ltd.

芯海科技芯海科技（深圳）股份有限公司

上传：深圳市奥诗达电子有限公司