RS232/422 Low Cap, #24-19pr, FPE, Indiv. Foil, PVC Jkt, CM, 100Ω

Product Description Computer EIA RS-232/422, Digital Audio Cable, 19-Pair, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, individually shielded with Beldfoil® (100 coverage), 24 AWG stranded tinned copper drain wire, overall PVC jacket.

文件：174.08 Kbytes 页数：2 Pages

BELDEN

百通

3M Double Coated Splicing Tapes

文件：346.18 Kbytes 页数：3 Pages

3M

RS232/422 Low Cap, #24-19pr, FPE, Indiv. Foil, PVC Jkt, CM, 100Ω

Product Description Computer EIA RS-232/422, Digital Audio Cable, 19-Pair, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, individually shielded with Beldfoil® (100 coverage), 24 AWG stranded tinned copper drain wire, overall PVC jacket.

文件：174.08 Kbytes 页数：2 Pages

BELDEN

百通

Synchronous Buck NexFET Power Stage

文件：1.40054 Mbytes 页数：20 Pages

TI

德州仪器

3M Double Coated Splicing Tapes

文件：346.18 Kbytes 页数：3 Pages

3M

丝印：97370AM；Package：LSON-CLIP；Synchronous Buck NexFET™ Power Stage

1FEATURES • 90% System Efficiency at 25A • Input Voltages up to 22V • High Frequency Operation (Up To 2MHz) • Incorporates Power Block Technology • High Density – SON 5-mm × 6-mm Footprint • Low Power Loss 2.8W at 25A • Ultra Low Inductance Package • System Optimized PCB Footprint • U

文件：909.51 Kbytes 页数：24 Pages

TI

德州仪器

丝印：97370AM；Package：LSON-CLIP；Synchronous Buck NexFET™ Power Stage

1FEATURES • 90% System Efficiency at 25A • Input Voltages up to 22V • High Frequency Operation (Up To 2MHz) • Incorporates Power Block Technology • High Density – SON 5-mm × 6-mm Footprint • Low Power Loss 2.8W at 25A • Ultra Low Inductance Package • System Optimized PCB Footprint • U

文件：909.51 Kbytes 页数：24 Pages

TI

德州仪器

丝印：97370M；Package：LSON-CLIP；Synchronous Buck NexFET™ Power Stage

1FEATURES • 90% System Efficiency at 25A • Input Voltages up to 22V • High Frequency Operation (Up To 2MHz) • Incorporates Power Block Technology • High Density – SON 5-mm × 6-mm Footprint • Low Power Loss 2.8W at 25A • Ultra Low Inductance Package • System Optimized PCB Footprint • 3

文件：730.69 Kbytes 页数：20 Pages

TI

德州仪器

丝印：97370M；Package：LSON-CLIP；Synchronous Buck NexFET™ Power Stage

1FEATURES • 90% System Efficiency at 25A • Input Voltages up to 22V • High Frequency Operation (Up To 2MHz) • Incorporates Power Block Technology • High Density – SON 5-mm × 6-mm Footprint • Low Power Loss 2.8W at 25A • Ultra Low Inductance Package • System Optimized PCB Footprint • 3

文件：730.69 Kbytes 页数：20 Pages

TI

德州仪器

丝印：97374M；Package：VSON-CLIP；CSD97374Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Over 92% System Efficiency at 15 A • Max Rated Continuous Current 25 A, Peak 60 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm x 4.5-mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • Ultra-Low Quiescent (ULQ) Current Mode

文件：661.16 Kbytes 页数：23 Pages

TI

德州仪器