OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

文件：96.57 Kbytes 页数：6 Pages

TI

德州仪器

OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

文件：582.26 Kbytes 页数：14 Pages

TI

德州仪器

具有三态输出的 8 通道、3V 至 5.5V 反相器

This octal buffer/line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. This device provides inverting outputs and symmetrical active-low output-enable () inputs. This device fea • Flow-Through Architecture Optimizes PCB Layout \n• EPICTM (Enhanced-Performance Implanted CMOS) 1-m Process \n• Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-mil DIPs (NT) \n   EPIC is a trademark of Texas Instruments Incorpora;

TI

德州仪器

丝印：AE240；Package：SSOP；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

丝印：AE240；Package：SSOP；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

丝印：AC11240；Package：SOIC；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

丝印：AC11240；Package：SOIC；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

丝印：AE240；Package：TSSOP；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

丝印：AE240；Package：TSSOP；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器