丝印：AE240；Package：SSOP；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

丝印：AE240；Package：SSOP；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

丝印：AE240；Package：TSSOP；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器

丝印：AE240；Package：TSSOP；OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-
m Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-

文件：420.85 Kbytes 页数：16 Pages

TI

德州仪器