丝印：5962-9088901MCA；Package：CDIP；QUADRUPLE BUS BUFFER GATES WITH 3-STATE OUTPUTS

State-of-the-Art BiCMOS Design Significantly Reduces ICCZ ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W),

文件：849.61 Kbytes 页数：13 Pages

TI

德州仪器

丝印：5962-9088901MCA；Package：CDIP；QUADRUPLE BUS BUFFER GATES WITH 3-STATE OUTPUTS

State-of-the-Art BiCMOS Design Significantly Reduces ICCZ ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W),

文件：849.61 Kbytes 页数：13 Pages

TI

德州仪器

丝印：5962-9088901MCA；Package：CDIP；QUADRUPLE BUS BUFFER GATES WITH 3-STATE OUTPUTS

State-of-the-Art BiCMOS Design Significantly Reduces ICCZ ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W),

文件：849.61 Kbytes 页数：13 Pages

TI

德州仪器

丝印：5962-9088901MCA；Package：CDIP；QUADRUPLE BUS BUFFER GATES WITH 3-STATE OUTPUTS

State-of-the-Art BiCMOS Design Significantly Reduces ICCZ ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W),

文件：849.61 Kbytes 页数：13 Pages

TI

德州仪器

QUADRUPLE BUS BUFFER GATES WITH 3-STATE OUTPUTS

文件：237.26 Kbytes 页数：10 Pages

TI

德州仪器