11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W ƒ On-board LPDDR4x-4267 up to 32G with IBECC for Industrial Sku ƒ Dual independent display: eDP/MIPI-DSI, DP up to 8K ƒ 2 GbE, 2 USB 3.2, COM Port, SMBus/I2C ƒ Expansion: M.2 E-Key, M.2 B-Key/M-Key NVMe x2 ƒ Supports i

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Intel Atom x6000, Pentium and Celeron® x6000 Series Processor (Code Name: Elkhart Lake) SMARC Module

Features ƒ Intel Atom® x6000, Pentium® and Celeron® x6000 Series processor ƒ SMARC2.1.1 pinout, small size ƒ Dual-CH LPDDR4 3200MT/s up to 16GB, support IBECC ƒ Triple displays up to 4K2K (DP++, HDMI, LVDS/eDP/MIPI-DSI) ƒ Multiple I/O expansion: PCIe gen3, USB3.2 Gen2, USB2.0, SATA ƒ On boar

文件：5.9148 Mbytes 页数：7 Pages

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Intel Atom x6000, Pentium and Celeron® x6000 Series Processor (Code Name: Elkhart Lake) SMARC Module

Features ƒ Intel Atom® x6000, Pentium® and Celeron® x6000 Series processor ƒ SMARC2.1.1 pinout, small size ƒ Dual-CH LPDDR4 3200MT/s up to 16GB, support IBECC ƒ Triple displays up to 4K2K (DP++, HDMI, LVDS/eDP/MIPI-DSI) ƒ Multiple I/O expansion: PCIe gen3, USB3.2 Gen2, USB2.0, SATA ƒ On boar

文件：5.9148 Mbytes 页数：7 Pages

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AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

文件：4.18813 Mbytes 页数：6 Pages

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AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

文件：4.18813 Mbytes 页数：6 Pages

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Intel® 11th Gen Core Processors (Code Name: Tiger Lake-H) (Code Name: Tiger Lake-H)

Features ƒ Intel® 11th Gen Core Processors, up to 8Core/16T, L3 Cache 24M ƒ Intel Iris Xe(Gen 12) graphics, 4 independent 4K display ƒ Dual channel DDR4 Max 128GB SODIMM, support ECC ƒ Super speed I/O: PCIe4 x16 (16GT/s), USB3.2 gen3 (10Gb), 2.5GbE, SATA3 (6Gb) ƒ TPM2.0 security protection,

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Intel® Xeon® D Processor (Code Name: Ice Lake-D LCC) COM Express® Basic Type7

Features ƒ Intel® Xeon® D Processor ƒ COM Express R3.0 Basic Module Type 7 pin out ƒ 4~10 core processor, with max. TDP 67W ƒ High speed Ethernet (4 x 10GBASE-KR interfaces, one GbE) ƒ Various expansion (PCIe x16 Gen4, PCIe X8, 4PCIe X1, 4 USB3.0, 2 SATA3) ƒ Supports SUSI, DeviceOn and Edge

文件：473.66 Kbytes 页数：2 Pages

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2U Edge Sever with 3rd Gen. Intel® Xeon® Scalable Processors

Features ƒ Balanced CPU & GPU performance by spread core layout ƒ Wide temperature support up to 45C ƒ Up to 5 x low profile or 2 x DW FH/FL PCIe gen4 slots ƒ 6 x 2.5 HDD and 2 x M.2 NVME ƒ Up to 16 x DDR4 3200 RDIMM / LRDIMM ƒ Advantech platfrom management by Redfish and secured web interfa

文件：813.88 Kbytes 页数：2 Pages

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Intel® Atom® x6000E series and Intel Celeron N and J series 3.5 SBC

Features ƒ Atom® x6000E series and Intel® Celeron® J and N series with Quad/Dual Cores, TDP 6W/ 10W/ 12W ƒ Single Channel DDR4-3200 up to 32GB ƒ 3 independent displays via LVDS, DP1.4, and HDMI2.0 up to 4K@60Hz ƒ Dual GbE, 6 USB, 6 UART, TPM2.0 ƒ CE/FCC Class B, Coastline I/O ESD 8KV/15KV Cr

文件：5.45438 Mbytes 页数：6 Pages

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Intel® Atom® x6000E series and Intel Celeron N and J series 3.5 SBC

Features ƒ Atom® x6000E series and Intel® Celeron® J and N series with Quad/Dual Cores, TDP 6W/ 10W/ 12W ƒ Single Channel DDR4-3200 up to 32GB ƒ 3 independent displays via LVDS, DP1.4, and HDMI2.0 up to 4K@60Hz ƒ Dual GbE, 6 USB, 6 UART, TPM2.0 ƒ CE/FCC Class B, Coastline I/O ESD 8KV/15KV Cr

文件：5.45438 Mbytes 页数：6 Pages

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