Heyco® Foam Washers

文件：94.33 Kbytes 页数：1 Pages

HEYCO

9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W ƒ Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU ƒ Triple simultaneous displays with 48-bit LVDS+HDMI+DP ƒ USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD ƒ Dual GbE, SATAIII, RS-232/422/485, CA

文件：1.8667 Mbytes 页数：6 Pages

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Intel® Atom™ E3900 / Pentium® / Celeron® N Series SMARC Module

Features ƒ SMARC2.0 & SMARC2.1 Compliance ƒ Intel® Atom™ E3900 / Pentium® / Celeron® N Series Processors ƒ Integrated dual GbE. wireless module on board design ƒ Dual channel LPDDR4 2/4/8 GB memory down & onboard eMMC ƒ Triple display (DP++, HDMI, LVDS) ƒ Supports iManager, WISE-PaaS/DeviceO

文件：9.17742 Mbytes 页数：6 Pages

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Development Kit for SMARC 2.0/2.1 Computer-on-Module ROM-5720

Features ƒƒ 恩XP i.MX 8M processor with dual or quad Arm Cortex A53 cores ƒƒ 1 x Arm Cortex-M4 core ƒƒ Onboard 2GB LPDDR4 memory and eMMC 16GB ƒƒ 1 x HDMI2.0 up to 4096 x 2160, 1 x 4-Lane MIPI DSI ƒƒ 2 x USB3.0, 4 x USB2.0, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera

文件：278.85 Kbytes 页数：2 Pages

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Intel Xeon Processor D-1500 COM Express R3.0 Type 7 Module for Ruggedized Application

Features ƒ COM Express R3.0 Basic Module Type 7 pin out ƒ Intel® Xeon® Processor D-1500 Product Family ƒ Solder-down memory w/ ECC, max. 32GB ƒ High speed Ethernet (dual 10GBASE-KR interfaces, one GbE) ƒ Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1) ƒ Supports iManager, WISE-PaaS/Device

文件：492.46 Kbytes 页数：2 Pages

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9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W ƒ Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU ƒ Triple simultaneous displays with 48-bit LVDS+HDMI+DP ƒ USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD ƒ Dual GbE, SATAIII, RS-232/422/485, CA

文件：1.8667 Mbytes 页数：6 Pages

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恩XP i.MX8X Cortex®-A35 SMARC 2.0/2.1 Computer-on-Module

Features ƒ 恩XP i.MX 8X processor with 2-4 x Arm Cortex-A35 cores ƒ 1 x Arm Cortex-M4F core and 1x Tensilica® HiFi 4 DSP ƒ Onboard 2GB LPDDR4 memory and eMMC 16GB ƒ 2 x single channel LVDS or 2 x 4-LANE MIPI DSI ƒ 1 x USB 3.0, 1 x USB 2.0 Host, 1 x USB2.0 OTG, 2 x CAN, 3 x UART, 4 x I2C, 12 x

文件：3.08386 Mbytes 页数：4 Pages

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Micro Computer, Intel® Core™ i7/i5/i3 CPU, H81, 2 Expansions, 250W 80Plus PSU

Features ƒ Intel® H81 Platform – Intel® 4th gen Core™ i7/i5/i3 CPU (LGA1150) – One PCIe x16* & one PCIe x4 Expansion Slots ƒ Compact, well-thought-out design – Two internal, shock-resistant, 2.5 SATA HDD bays – Front accessible I/O: VGA+DVI-D, 2 GbE LAN, 3 USB2.0, 2 COM – Easy-to-maintain s

文件：955.2 Kbytes 页数：2 Pages

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Micro Computer with Intel® Core™ i7/i5/i3 Processor, Intel® H110 Chipset, 2 x Expansion Slots, and 250W 80PLUS PSU

Features ƒ Intel® 6th/7th Gen Core™ i7/i5/i3/Celeron® processer with Intel® H110 chipset ƒ 1 x PCIe x16 and 1 x PCIe x4(1 x PCI for AIMC-3202-01) expansion slots ƒ Compact design with front-accessible I/O ƒ 1 x VGA+DVI-D, 2 x GbE LAN, 3 x USB 3.0, 2 x COM ƒ 2 x 2.5 internal, shock-resistant S

文件：1.66371 Mbytes 页数：3 Pages

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Intel 8th Gen U Series CORE i3/i5/i7 CPU,eDP (LVDS), 2 HDMI, 2 LAN, 2 USB3.2 Gen2 x1, 4 COM (RS-232/422/485),M.2 E-Key, M.2 B-Key, M.2 M-Key NVMe

Features ƒ Intel® 8th Gen Core™ i3-8145UE / i5-8365UE / i7-8665UE/CELERON 4305UE ƒ Supports 1 x DDR4-2400 SO-DIMM ƒ Supports 1 x eDP (LVDS co-lay), 2 x HDMI, 3 Independent Displays ƒ Supports 2 x LAN, 2 x USB3.2 Gen2 x1 Type-A Ports, 4 COM Ports (RS-232/422/485, selected via BIOS) ƒ Support

文件：581.94 Kbytes 页数：2 Pages

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