Rockchip RK3399 Cortex®-A72A53 SMARC 2.1 Computer-on-Module

Features ƒ Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz ƒ Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC ƒ Support HDMI2.0 4K, 1 x eDP, 1 x LVDS ƒ Support 4K H.264/H.265 Video decoder ƒ 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO ƒ 1 x PCIe2.0, 1 x SATA, 2 x M

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Rockchip RK3399 Cortex®-A72A53 SMARC 2.1 Computer-on-Module

Features ƒ Rockchip RK3399 Arm dual Cortex-A72 and quad Cortex-A53 1.8 GHz ƒ Onboard 2/4GB LPDDR4 memory and 16/32GB eMMC ƒ Support HDMI2.0 4K, 1 x eDP, 1 x LVDS ƒ Support 4K H.264/H.265 Video decoder ƒ 2 x USB3.0, 3 x USB2.0,1 x USB2,0 OTG, 3 x UART, 12 x GPIO ƒ 1 x PCIe2.0, 1 x SATA, 2 x M

文件：3.67105 Mbytes 页数：5 Pages

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11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

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11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

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LGA 4094 AMD® EPYC™ 7003 ATX server motherboard

characteristic LGA 4094 (Socket SP3) ATX server board with AMD EPYC™ 7003 Processor DDR4 3200 MHz RDIMM up to 256GB per DIMM 5x PCIe 4.0 x16, 2x PCIe 4.0 x8 Intel® X550 dual 10GbE port 8 (via SFF-8643 ports) + 1 SATA 3 and 2 M.2 ports (SATA/PCIe 4.0 compatible) 0 ~ 60 °C operating temperat

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11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

文件：5.52344 Mbytes 页数：6 Pages

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11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

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AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

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恩XP Arm® Cortex®-A72 LS1046A COM Express Type 7 Compact

Features ƒ 恩XP LS1046A, 4 x Cortex A72 1.6GHz ƒ Onboard Micro SD slot and eMMC 16GB ƒ 1 SO-DIMM supports ECC and Non-ECC DDR4 ƒ 10GBase-KR x2, GbE up to 4, PCIe 1x x3, USB 3.2 Gen1 x3, USB 2.0.x3, SATA V3.0 x1 ƒ 4 wires UART x2, SPI x1, GPIO x8, I2C ƒ DPAA (Data Path Architecture Accelerati

文件：974.9 Kbytes 页数：2 Pages

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11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

文件：4.1535 Mbytes 页数：6 Pages

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