丝印：W3；Package：SOD-123；SOD-123 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction 350mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version

文件：2.92456 Mbytes 页数：6 Pages

UNSEMI

优恩半导体

丝印：W3；Package：SOD-123；SURFACE MOUNT ZENER DIODES

FEATURES： Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Available in Lead Free Version

文件：1.4586 Mbytes 页数：6 Pages

SY

顺烨电子

丝印：W3；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：79.14 Kbytes 页数：3 Pages

DIODES

美台半导体

丝印：W3；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：73.25 Kbytes 页数：3 Pages

DIODES

美台半导体

丝印：W3；Package：SOD-123；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

文件：122.25 Kbytes 页数：5 Pages

DIODES

美台半导体

丝印：W3；Package：SOD-323；Plastic-Encapsulate Zener Diode

Features ● Low Zener Impedance ● 200mW; Power Dissipation of 200mW ● High Stability and High Reliability

文件：1.11124 Mbytes 页数：5 Pages

LEIDITECH

雷卯电子

丝印：W3；Package：SOD-323；SURFACE MOUNT ZENER DIODES

FEATURES Planar die construction 200mW power dissipation on ceramic PBC General purpose, medium current Ideally suited for automated assembly processes Available in lead free version

文件：1.00256 Mbytes 页数：5 Pages

SY

顺烨电子

丝印：W3；Package：SOD-323；SOD-323 Plastic-Encapsulate Zener Diodes

Features Planar Die Construction General Purpose, Medium Current 200mW Power Dissipation On Ceramic PBC Ideally Suited for Automated Assembly Processes Available in Lead Free Version

文件：3.0583 Mbytes 页数：7 Pages

UNSEMI

优恩半导体

丝印：W3；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Ultra-Small Surface Mount Package • Ideally suited for Automated Assembly Processes

文件：260.47 Kbytes 页数：3 Pages

YIXIN

壹芯微

丝印：W3；Package：SOD-323；Zener Diodes

■ Features ● Planar die construction ● 200mW power dissipation on ceramic PBC ● General purpose, medium current ● Ideally suited for automated assembly processes ● Available in lead free version

文件：1.11581 Mbytes 页数：4 Pages

YFWDIODE

佑风微