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SST12LP19E中文资料2.4 GHz High-Power, High-Gain Power Amplifier数据手册Microchip规格书

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厂商型号

SST12LP19E

参数属性

SST12LP19E 封装/外壳为6-XFDFN 裸露焊盘;包装为卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带;类别为RF/IF射频/中频RFID的射频放大器;产品描述:IC AMP 802.11B/G/N 2.4GHZ 6XSON

功能描述

2.4 GHz High-Power, High-Gain Power Amplifier
IC AMP 802.11B/G/N 2.4GHZ 6XSON

封装外壳

6-XFDFN 裸露焊盘

制造商

Microchip Microchip Technology

中文名称

微芯科技 美国微芯科技公司

数据手册

原厂下载下载地址下载地址二

更新时间

2025-9-25 23:01:00

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SST12LP19E价格和库存,欢迎联系客服免费人工找货

SST12LP19E规格书详情

描述 Description

The SST12LP19E is a 2.4 GHz high-efficiency Power Amplifier based on the highlyreliable InGaP/GaAs HBT technology and designed in compliance with IEEE 802.11b/g/n applications. It typically provides 25 dB gain with 34% power-addedefficiency, while meeting 802.11g spectrum mask at 23.5 dBm. The SST12LP19E also features easy board-level usage, along with high-speed power-up/-down control through a single combined reference voltage pin, and is offered in both a 6-contact XSON and 8-contact XSON package.

特性 Features

Excellent RF Stability with Moderate Gain:– Typically 25 dB gain across 2.4 – 2.5 GHz
High linear output power:– >26 dBm P1dB– Meets 802.11g OFDM ACPR requirement up to 23.5 dBm– ~2.5% added EVM up to 18 dBm (high-efficiency configuration) or ~3% added EVM up to 19.5 dBm (highpowerconfiguration) for 54 Mbps 802.11g signal– 17 dBm at 1.8% EVM, 802.11ac, 256 QAM, 2.4 GHz– Meets 802.11b ACPR requirement up to 23 dBm
High power-added efficiency/Low operating currentfor 802.11b/g/n applications– ~34%/200 mA@POUT = 23.5 dBm for 802.11g– ~31%/195 mA@POUT = 23 dBm for 802.11bApplications
WLAN (IEEE 802.11b/g/n/ac)
Home RF
Cordless phones
2.4 GHz ISM wireless equipment

简介

SST12LP19E属于RF/IF射频/中频RFID的射频放大器。由制造生产的SST12LP19E射频放大器在射频应用中,射频放大器产品可用于信号增益和缓冲。这些产品与通用运算放大器的不同之处在于,它们通常适用于更高的频率,更倾向于提供不可调节的固定增益,并且输入或输出阻抗值符合常用传输线特性阻抗。

技术参数

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  • 产品编号:

    SST12LP19E-QX6E

  • 制造商:

    Microchip Technology

  • 类别:

    RF/IF,射频/中频和 RFID > 射频放大器

  • 包装:

    卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带

  • 频率:

    2.4GHz ~ 2.5GHz

  • 射频类型:

    802.11b/g/n

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    6-XFDFN 裸露焊盘

  • 供应商器件封装:

    6-XSON(1.5x1.5)

  • 描述:

    IC AMP 802.11B/G/N 2.4GHZ 6XSON

供应商 型号 品牌 批号 封装 库存 备注 价格
SST
24+
NA/
23213
原厂直销,现货供应,账期支持!
询价
SST
24+
NA
880000
明嘉莱只做原装正品现货
询价
SST
12
XSON-6
2645
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
SST
原厂封装
9800
原装进口公司现货假一赔百
询价
N/A
23+
NA
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
MicrochipTechnology
24+
原厂原装
6000
进口原装正品假一赔十,货期7-10天
询价
只做原装
24+
36520
一级代理/放心采购
询价
Microchip
25+
原厂原装
16000
原装优势绝对有货
询价
MICROCHIP
23+
NA
2000
专业电子元器件供应链正迈科技特价代理特价,原装元器件供应,支持开发样品
询价
Microchip
20+
6-XFDFN
3000
无线通信IC,大量现货!
询价