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SST12LF02中文资料2.4 GHz High-Gain, High-Efficiency Front-end Module数据手册Microchip规格书

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厂商型号

SST12LF02

参数属性

SST12LF02 封装/外壳为16-VFQFN 裸露焊盘;包装为剪切带(CT)Digi-Reel® 得捷定制卷带;类别为RF/IF射频/中频RFID的射频前端(LNA+PA);产品描述:IC AFE WLAN 11B/G/N 16XQFN

功能描述

2.4 GHz High-Gain, High-Efficiency Front-end Module
IC AFE WLAN 11B/G/N 16XQFN

封装外壳

16-VFQFN 裸露焊盘

制造商

Microchip Microchip Technology

中文名称

微芯科技 美国微芯科技公司

数据手册

原厂下载下载地址下载地址二

更新时间

2025-9-27 9:22:00

人工找货

SST12LF02价格和库存,欢迎联系客服免费人工找货

SST12LF02规格书详情

描述 Description

The SST12LF02 is a 2.4 GHz Front-end Module (FEM)designed in compliance with IEEE 802.11b/g/n applications.It combines a high-performance Power Amplifier (PA)and a switch. There are three components to the FEM: theReceiver (RX) chain, the Transmitter (TX) chain, and theBluetooth® (BT) chain.The TX chain includes a high-efficiency PA based on theInGaP/GaAs HBT technology. This chain typically provides29 dB gain with 30% power-added efficiency (PAE) @POUT = 22 dBm for 802.11g and 29% PAE@POUT = 22dBm for 802.11bThe TX chain has excellent linearity, typically ~2.5% addedEVM at 18 dBm output power which is essential for 54Mbps 802.11g operation while meeting 802.11g spectrummask at 22 dBm.The SST12LF02 also features easy board-level usagealong with high-speed power-up/down controls. Ultra-lowreference current (total IREF ~2 mA) makes the SST12LF02controllable by an on/off switching signal directly from thebaseband chip. These features, coupled with low operatingcurrent, make the SST12LF02 ideal for the final stagepower amplification in battery-powered 802.11b/g/n WLANtransmitter applications.

特性 Features

Applications:-WLAN (IEEE 802.11b/g/n) Home RF; Cordless phones; -2.4 GHz ISM wireless equipment
• Features:High Gain:– Typically 29 dB gain across 2.4~2.5 GHz over temperature 0°C to +85°C for Transmitter (TX) chain.
• High linear output power:– >24 dBm P1dB- Please refer to “Absolute Maximum StressRatings” on page 4– Meets 802.11g OFDM ACPR requirement up to22 dBm– ~2.5% added EVM up to 18 dBm for 54 Mbps 802.11g signal– Meets 802.11b ACPR requirement up to 22 dBm
• Excellent On-chip power detection
• 20 dB dynamic range on-chip power detection
• Input/output ports matched to 50O internally and DC decoupled.
• Packages available– 16-contact XQFN – 3mm x 3mm
• All non-Pb (lead-free) devices are RoHS compliant

简介

SST12LF02属于RF/IF射频/中频RFID的射频前端(LNA+PA)。由制造生产的SST12LF02射频前端(LNA + PA)本系列中的产品是各种集成电路,其中集成了射频 (RF) 信号链连接到系统天线的部分中常见的一种或多种功能,如低噪声放大器 (LNA) 和可编程放大器 (PA)。任何给定器件所含的实际功能各不相同,相比旨在提供更高应用灵活性的器件,针对相对较窄应用的器件通常集成更大一部分必要的信号链。

技术参数

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  • 产品编号:

    SST12LF02-QXCE

  • 制造商:

    Microchip Technology

  • 类别:

    RF/IF,射频/中频和 RFID > 射频前端(LNA + PA)

  • 包装:

    剪切带(CT)Digi-Reel® 得捷定制卷带

  • 射频类型:

    802.11b/g/n

  • 频率:

    2.4GHz

  • 封装/外壳:

    16-VFQFN 裸露焊盘

  • 供应商器件封装:

    16-QFN(3x3)

  • 描述:

    IC AFE WLAN 11B/G/N 16XQFN

供应商 型号 品牌 批号 封装 库存 备注 价格
MicrochipTechnology
24+
原厂原装
6000
进口原装正品假一赔十,货期7-10天
询价
SST
08+PBF
QFN
150
现货
询价
MICROCHIP
23+
NA
10021
专业电子元器件供应链正迈科技特价代理特价,原装元器件供应,支持开发样品
询价
MICROCHIP/微芯
23+
UQFN6
4600
原装正品假一罚百!可开增票!
询价
SST
24+
QFN
65200
一级代理/放心采购
询价
Microchip Technology
24+
UQFN6
12800
强势渠道订货 7-10天
询价
MICROCHIP/微芯
23+
UQFN6
4600
十七年VIP会员,诚信经营,一手货源,原装正品可零售!
询价
Microchip
25+
原厂原装
16000
原装优势绝对有货
询价
SST
21+
UQFN
2700
询价
Microchip
2022+
原厂原包装
6800
全新原装 支持表配单 中国著名电子元器件独立分销
询价