1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER POWERDI123

Features Glass Passivated Die Construction Ideally Suited for Automated Assembly Low Profile Design, Package Height Less than 1.0mm Low Reverse Leakage Current Exceptional Thermal Transfer Based on Exposed Heat Sink on the Underside of the Device Lead-Free Finish; RoHS Compliant (Notes 1 &

文件：474.4 Kbytes 页数：5 Pages

DIODES

美台半导体

1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER

The S1MSP1 is a rectifier packaged in the PowerDI123. Providing high-reverse breakdown voltage and high-current capability for standard rectification. Glass Passivated Die Construction\nSmall Form Factor, Low Profile\nIdeally Suited for Automated Assembly\nQualified to AEC-Q101 Standards for High Reliability;

Diodes

美台半导体

丝印：PowerDI123；1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER POWERDI123

Features Glass Passivated Die Construction Ideally Suited for Automated Assembly Low Profile Design, Package Height Less than 1.0mm Low Reverse Leakage Current Exceptional Thermal Transfer Based on Exposed Heat Sink on the Underside of the Device Lead-Free Finish; RoHS Compliant (Notes 1 &

文件：474.4 Kbytes 页数：5 Pages

DIODES

美台半导体

1.0A SURFACE MOUNT STANDARD RECOVERY RECTIFIER PowerDI123

Features - Glass Passivated Die Construction - Ideally Suited for Automated Assembly - Low Profile Design, Package Height Less than 1.0mm - Low Reverse Leakage Current - Exceptional Thermal Transfer Based on Exposed Heat Sink on the Underside of the Device - Lead-Free Finish; RoHS Compliant

文件：567.15 Kbytes 页数：5 Pages

DIODES

美台半导体

丝印：G20；Package：PowerDI123；1.0A SURFACE MOUNT STANDARD RECOVERY RECTIFIER PowerDI123

Features - Glass Passivated Die Construction - Ideally Suited for Automated Assembly - Low Profile Design, Package Height Less than 1.0mm - Low Reverse Leakage Current - Exceptional Thermal Transfer Based on Exposed Heat Sink on the Underside of the Device - Lead-Free Finish; RoHS Compliant

文件：567.15 Kbytes 页数：5 Pages

DIODES

美台半导体

1.0A SURFACE MOUNT STANDARD RECOVERY RECTIFIER

The DIODES™ S1MSP1M is a rectifier packaged in the PowerDI®123 package. Providing high-reverse breakdown voltage and high-current capability for standard rectification, this device is ideal for use in applications such as:\n\n\nSwitching-mode power-supply applications\nDC-DC converter applications\n

Diodes

美台半导体

Package：POWERDI®123；包装：散装 类别：分立半导体产品 二极管 - 整流器 - 单 描述：DIODE GEN PURP 1KV 1A POWRDI 123

DIODES

美台半导体

Package：POWERDI®123；包装：散装 类别：分立半导体产品 二极管 - 整流器 - 单 描述：DIODE

DIODES

美台半导体