OMAP5910中文资料应用处理器数据手册TI规格书
OMAP5910规格书详情
描述 Description
The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.
The OMAP platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.
The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.
The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS software kernel foundation, and is available in a 289-ball MicroStar BGA package.
The OMAP5910 is targeted at the following applications:
Applications processing devices Mobile communications 802.11 Bluetooth wireless technology GSM (including GPRS and EDGE) CDMA Proprietary government and other Video and image processing (MPEG4, JPEG, Windows® Media Video, etc.) Advanced speech applications (text-to-speech, speech recognition) Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs) Graphics and video acceleration Generalized web access Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)
The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.
The OMAP platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.
The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.
The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS software kernel foundation, and is available in a 289-ball MicroStar BGA package.
The OMAP5910 is targeted at the following applications:
Applications processing devices Mobile communications 802.11 Bluetooth wireless technology GSM (including GPRS and EDGE) CDMA Proprietary government and other Video and image processing (MPEG4, JPEG, Windows® Media Video, etc.) Advanced speech applications (text-to-speech, speech recognition) Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs) Graphics and video acceleration Generalized web access Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)
特性 Features
• Low-Power, High-Performance CMOS Technology
• 1.6-V Core Voltage
• TI925T (MPU) ARM9TDMI™ Core
• 16K-Byte Instruction Cache
• Data and Program Memory Management Units (MMUs)
• 17-Word Write Buffer
• TMS320C55x™ (C55x™) DSP Core
• Dual Multipliers (Two Multiply-Accumulates per Cycle)
• One Internal Program Bus
• 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes)
• 16K x 16-Bit On-Chip ROM (32K Bytes)
• Video Hardware Accelerators for DCT, IDCT, Pixel Interpolation, and Motion Estimation for Video Compression
• 192K Bytes of Shared Internal SRAM
• 16-Bit EMIFS External Memory Interface to Access up to 128M Bytes of Flash, ROM, or ASRAM
• 9-Channel System DMA Controller
• Endianism Conversion Logic
• DSP Peripherals
• Level1/Level2 Interrupt Handlers
• Two Multichannel Buffered Serial Ports
• TI925T Peripherals
• 32-kHz Timer
• USB (Full/Low Speed) Host Interface With up to 3 Ports
• One Integrated USB Transceiver for Either Host or Function
• Inter-Integrated Circuit (I2C) Master and Slave Interface
• Multimedia Card (MMC) and Secure Digital (SD) Interface
• Camera Interface for CMOS Sensors
• Keyboard Matrix Interface (6 x 5 or 8 x 8)
• Pulse-Width Tone (PWT) Interface
• Two LED Pulse Generators (LPGs)
• LCD Controller With Dedicated System DMA Channel
• Shared Peripherals
• Four Interprocessor Mailboxes
• Individual Power-Saving Modes for MPU/DSP/TC
• IEEE Std 1149.1 (JTAG) Boundary Scan Logic
• Two 289-Ball MicroStar BGA™ (Ball Grid Array) Package Options (GZG and GDY Suffixes)
TMS320C55x, C55x, and MicroStar BGA are trademarks of Texas Instruments. ARM9TDMI is a trademark of ARM Limited. Thumb is a registered trademark of ARM Limited. Microwire is a trademark of National Semiconductor Corporation. 1-Wire is a registered trademark of Dallas Semiconductor Corporation. IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture. OMAP and DSP/BIOS are trademarks of Texas Instruments. Bluetooth is a trademark owned by Bluetooth SIG, Inc. Windows is a registered trademark of Microsoft Corporation. Other trademarks are the property of their respective owners.
技术参数
- 制造商编号
:OMAP5910
- 生产厂家
:TI
- Arm MHz (Max.)
:192
- Co-processor(s)
:C55x DSP
- CPU
:32-bit
- Hardware accelerators
:Video Hardware Accelerators for DCT/iDCT
- Operating system
:Linux
- Security
:Device identity
- Rating
:Catalog
- Operating temperature range (C)
:-40 to 85
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI |
25+ |
BGA289 |
4500 |
全新原装、诚信经营、公司现货销售! |
询价 | ||
4 |
394 |
原装正品 |
询价 | ||||
TI |
25+ |
BGA |
18000 |
原厂直接发货进口原装 |
询价 | ||
TI |
24+ |
NFBGA|289 |
70230 |
免费送样原盒原包现货一手渠道联系 |
询价 | ||
TI |
23+ |
原厂封装 |
13528 |
振宏微原装正品,假一罚百 |
询价 | ||
TI/德州仪器 |
24+ |
BGA |
30000 |
房间原装现货特价热卖,有单详谈 |
询价 | ||
TI |
25+23+ |
BGA |
53408 |
绝对原装正品现货,全新深圳原装进口现货 |
询价 | ||
TI |
2138+ |
BGA |
8960 |
专营BGA,QFP原装现货,假一赔十 |
询价 | ||
TI |
2008 |
BGA |
156 |
原装现货海量库存欢迎咨询 |
询价 | ||
Texas |
25+ |
25000 |
原厂原包 深圳现货 主打品牌 假一赔百 可开票! |
询价 |