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OMAP5910数据手册集成电路(IC)的微处理器规格书PDF

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厂商型号

OMAP5910

参数属性

OMAP5910 封装/外壳为289-BGA;包装为管件;类别为集成电路(IC)的微处理器;产品描述:IC MPU OMAP-59XX 150MHZ 289BGA

功能描述

应用处理器

封装外壳

289-BGA

制造商

TI Texas Instruments

中文名称

德州仪器 美国德州仪器公司

数据手册

下载地址下载地址二

更新时间

2025-8-9 9:31:00

人工找货

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OMAP5910规格书详情

描述 Description

The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.

The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS™ software kernel foundation, and is available in a 289-ball MicroStar BGA package.

The OMAP5910 is targeted at the following applications:

Applications processing devices Mobile communications 802.11 Bluetooth™ wireless technology GSM (including GPRS and EDGE) CDMA Proprietary government and other Video and image processing (MPEG4, JPEG, Windows® Media Video, etc.) Advanced speech applications (text-to-speech, speech recognition) Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs) Graphics and video acceleration Generalized web access Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)

The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.

The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS™ software kernel foundation, and is available in a 289-ball MicroStar BGA package.

The OMAP5910 is targeted at the following applications:

Applications processing devices Mobile communications 802.11 Bluetooth™ wireless technology GSM (including GPRS and EDGE) CDMA Proprietary government and other Video and image processing (MPEG4, JPEG, Windows® Media Video, etc.) Advanced speech applications (text-to-speech, speech recognition) Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs) Graphics and video acceleration Generalized web access Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)

特性 Features

• Low-Power, High-Performance CMOS Technology
• 0.13-µm Technology
• 1.6-V Core Voltage

• TI925T (MPU) ARM9TDMI™ Core
• Support 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
• 16K-Byte Instruction Cache
• 8K-Byte Data Cache
• Data and Program Memory Management Units (MMUs)
• Two 64-Entry Translation Look-Aside Buffers (TLBs) for MMUs
• 17-Word Write Buffer

• TMS320C55x™ (C55x™) DSP Core
• One/Two Instructions Executed per Cycle
• Dual Multipliers (Two Multiply-Accumulates per Cycle)
• Two Arithmetic/Logic Units
• One Internal Program Bus
• Five Internal Data/Operand Buses (3 Read Buses and 2 Write Buses)
• 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes)
• 48K x 16-Bit On-Chip Single-Access RAM (SARAM) (96K Bytes)
• 16K x 16-Bit On-Chip ROM (32K Bytes)
• Instruction Cache (24K Bytes)
• Video Hardware Accelerators for DCT, IDCT, Pixel Interpolation, and Motion Estimation for Video Compression

• 192K Bytes of Shared Internal SRAM
• Memory Traffic Controller (TC)
• 16-Bit EMIFS External Memory Interface to Access up to 128M Bytes of Flash, ROM, or ASRAM
• 16-Bit EMIFF External Memory Interface to Access up to 64M Bytes of SDRAM

• 9-Channel System DMA Controller
• DSP Memory Management Unit
• Endianism Conversion Logic
• Digital Phase-Locked Loop (DPLL) for MPU/DSP/TC Clocking Control
• DSP Peripherals
• Three 32-Bit Timers and Watchdog Timer
• Level1/Level2 Interrupt Handlers
• Six-Channel DMA Controller
• Two Multichannel Buffered Serial Ports
• Two Multichannel Serial Interfaces

• TI925T Peripherals
• Three 32-Bit Timers and Watchdog Timer
• 32-kHz Timer
• Level1/Level2 Interrupt Handlers
• USB (Full/Low Speed) Host Interface With up to 3 Ports
• USB (Full Speed) Function Interface
• One Integrated USB Transceiver for Either Host or Function
• Multichannel Buffered Serial Port
• Inter-Integrated Circuit (I2C) Master and Slave Interface
• Microwire™ Serial Interface
• Multimedia Card (MMC) and Secure Digital (SD) Interface
• HDQ/1-Wire® Interface
• Camera Interface for CMOS Sensors
• ETM9 Trace Module for TI925T Debug
• Keyboard Matrix Interface (6 x 5 or 8 x 8)
• Up to Ten MPU General-Purpose I/Os
• Pulse-Width Tone (PWT) Interface
• Pulse-Width Light (PWL) Interface
• Two LED Pulse Generators (LPGs)
• Real-Time Clock (RTC)
• LCD Controller With Dedicated System DMA Channel

• Shared Peripherals
• Three Universal Asynchronous Receiver/Transmitters (UARTs) (One Supporting SIR Mode for IrDA)
• Four Interprocessor Mailboxes
• Up to 14 Shared General-Purpose I/Os

• Individual Power-Saving Modes for MPU/DSP/TC
• On-Chip Scan-Based Emulation Logic
• IEEE Std 1149.1 (JTAG) Boundary Scan Logic
• Two 289-Ball MicroStar BGA™ (Ball Grid Array) Package Options (GZG and GDY Suffixes)
TMS320C55x, C55x, and MicroStar BGA are trademarks of Texas Instruments. ARM9TDMI is a trademark of ARM Limited. Thumb is a registered trademark of ARM Limited. Microwire is a trademark of National Semiconductor Corporation. 1-Wire is a registered trademark of Dallas Semiconductor Corporation. IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture. OMAP and DSP/BIOS are trademarks of Texas Instruments. Bluetooth is a trademark owned by Bluetooth SIG, Inc. Windows is a registered trademark of Microsoft Corporation. Other trademarks are the property of their respective owners.

技术参数

  • 制造商编号

    :OMAP5910

  • 生产厂家

    :TI

  • Arm MHz (Max.)

    :192

  • Co-processor(s)

    :C55x DSP

  • CPU

    :32-bit

  • Hardware accelerators

    :Video Hardware Accelerators for DCT/iDCT

  • Operating system

    :Linux

  • Security

    :Device identity

  • Rating

    :Catalog

  • Operating temperature range (C)

    :-40 to 85

供应商 型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
21+
BGA
10000
全新原装 公司现货 价格优
询价
TI
22+
289BGA
9000
原厂渠道,现货配单
询价
TI/德州仪器
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
Texas
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
询价
TI/德州仪器
1950+
BGA
4856
只做原装正品现货!或订货假一赔十!
询价
TI
20+
原厂封装
6965
英卓尔原装现货!0755-82566558真实库存!
询价
TI
23+
289-BGA
65480
询价
TI
23+
BGA-289
420
原厂原装
询价
TI
BGA
131
正品原装--自家现货-实单可谈
询价
原厂
13+
IC
1
普通
询价