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OMAP5910中文资料应用处理器数据手册TI规格书

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厂商型号

OMAP5910

参数属性

OMAP5910 封装/外壳为289-BGA;包装为管件;类别为集成电路(IC)的微处理器;产品描述:IC MPU OMAP-59XX 150MHZ 289BGA

功能描述

应用处理器

封装外壳

289-BGA

制造商

TI Texas Instruments

中文名称

德州仪器 美国德州仪器公司

数据手册

下载地址下载地址二

更新时间

2025-9-23 18:01:00

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OMAP5910规格书详情

描述 Description

The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.

The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS™ software kernel foundation, and is available in a 289-ball MicroStar BGA package.

The OMAP5910 is targeted at the following applications:

Applications processing devices Mobile communications 802.11 Bluetooth™ wireless technology GSM (including GPRS and EDGE) CDMA Proprietary government and other Video and image processing (MPEG4, JPEG, Windows® Media Video, etc.) Advanced speech applications (text-to-speech, speech recognition) Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs) Graphics and video acceleration Generalized web access Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)

The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.

The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS™ software kernel foundation, and is available in a 289-ball MicroStar BGA package.

The OMAP5910 is targeted at the following applications:

Applications processing devices Mobile communications 802.11 Bluetooth™ wireless technology GSM (including GPRS and EDGE) CDMA Proprietary government and other Video and image processing (MPEG4, JPEG, Windows® Media Video, etc.) Advanced speech applications (text-to-speech, speech recognition) Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs) Graphics and video acceleration Generalized web access Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)

特性 Features

• Low-Power, High-Performance CMOS Technology
• 1.6-V Core Voltage
• TI925T (MPU) ARM9TDMI™ Core
• 16K-Byte Instruction Cache
• Data and Program Memory Management Units (MMUs)
• 17-Word Write Buffer
• TMS320C55x™ (C55x™) DSP Core
• Dual Multipliers (Two Multiply-Accumulates per Cycle)
• One Internal Program Bus
• 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes)
• 16K x 16-Bit On-Chip ROM (32K Bytes)
• Video Hardware Accelerators for DCT, IDCT, Pixel Interpolation, and Motion Estimation for Video Compression
• 192K Bytes of Shared Internal SRAM
• 16-Bit EMIFS External Memory Interface to Access up to 128M Bytes of Flash, ROM, or ASRAM
• 9-Channel System DMA Controller
• Endianism Conversion Logic
• DSP Peripherals
• Level1/Level2 Interrupt Handlers
• Two Multichannel Buffered Serial Ports
• TI925T Peripherals
• 32-kHz Timer
• USB (Full/Low Speed) Host Interface With up to 3 Ports
• One Integrated USB Transceiver for Either Host or Function
• Inter-Integrated Circuit (I2C) Master and Slave Interface
• Multimedia Card (MMC) and Secure Digital (SD) Interface
• Camera Interface for CMOS Sensors
• Keyboard Matrix Interface (6 x 5 or 8 x 8)
• Pulse-Width Tone (PWT) Interface
• Two LED Pulse Generators (LPGs)
• LCD Controller With Dedicated System DMA Channel
• Shared Peripherals
• Four Interprocessor Mailboxes
• Individual Power-Saving Modes for MPU/DSP/TC
• IEEE Std 1149.1 (JTAG) Boundary Scan Logic
• Two 289-Ball MicroStar BGA™ (Ball Grid Array) Package Options (GZG and GDY Suffixes)
TMS320C55x, C55x, and MicroStar BGA are trademarks of Texas Instruments. ARM9TDMI is a trademark of ARM Limited. Thumb is a registered trademark of ARM Limited. Microwire is a trademark of National Semiconductor Corporation. 1-Wire is a registered trademark of Dallas Semiconductor Corporation. IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture. OMAP and DSP/BIOS are trademarks of Texas Instruments. Bluetooth is a trademark owned by Bluetooth SIG, Inc. Windows is a registered trademark of Microsoft Corporation. Other trademarks are the property of their respective owners.

技术参数

  • 制造商编号

    :OMAP5910

  • 生产厂家

    :TI

  • Arm MHz (Max.)

    :192

  • Co-processor(s)

    :C55x DSP

  • CPU

    :32-bit

  • Hardware accelerators

    :Video Hardware Accelerators for DCT/iDCT

  • Operating system

    :Linux

  • Security

    :Device identity

  • Rating

    :Catalog

  • Operating temperature range (C)

    :-40 to 85

供应商 型号 品牌 批号 封装 库存 备注 价格
TI
25+
BGA289
4500
全新原装、诚信经营、公司现货销售!
询价
4
394
原装正品
询价
TI
25+
BGA
18000
原厂直接发货进口原装
询价
TI
24+
NFBGA|289
70230
免费送样原盒原包现货一手渠道联系
询价
TI
23+
原厂封装
13528
振宏微原装正品,假一罚百
询价
TI/德州仪器
24+
BGA
30000
房间原装现货特价热卖,有单详谈
询价
TI
25+23+
BGA
53408
绝对原装正品现货,全新深圳原装进口现货
询价
TI
2138+
BGA
8960
专营BGA,QFP原装现货,假一赔十
询价
TI
2008
BGA
156
原装现货海量库存欢迎咨询
询价
Texas
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
询价