丝印：SQ；Package：SOT23；60 V, N-channel Trench MOSFET

description N-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. Features and benefits • Low threshold voltage • Very fast switching • Trench MOSFET technology • ElectroStatic Discharge (ESD)

文件：278.72 Kbytes 页数：14 Pages

NEXPERIA

安世

丝印：G6；Package：SOT363；60 V, dual N-channel Trench MOSFET

description Dual N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. Features and benefits • Low threshold voltage • Very fast switching • Trench MOSFET technology • ElectroSta

文件：288.45 Kbytes 页数：14 Pages

NEXPERIA

安世

丝印：3C；Package：SOT323；60 V, N-channel Trench MOSFET

1. General description N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 2. Features and benefits • Low threshold voltage • Very fast switching • Trench MOSFET technology • Ele

文件：278.26 Kbytes 页数：14 Pages

NEXPERIA

安世

丝印：2A；Package：SOT363；60 V / 50 V, 170 mA / 160 mA N/P-channel Trench MOSFET

1. General description Complementary N/P-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 2. Features and benefits • Trench MOSFET technology • Very fast switching • ElectroStat

文件：312.95 Kbytes 页数：22 Pages

NEXPERIA

安世

I/O Card Interface Connectors

■ Features 1. Low Profile Protorusion above the PCB board is only 2.9mm, and the connectors can be mounted to type I and II I/O cards. 2. EMI/RFI protection Full metal shielding. Shield connects first, ahead of contacts. 3. ESD Secure Thermoplastic molded covers assures insulatio

文件：409.67 Kbytes 页数：10 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

I/O Card Interface Connectors

■ Features 1. Low Profile Protorusion above the PCB board is only 2.9mm, and the connectors can be mounted to type I and II I/O cards. 2. EMI/RFI protection Full metal shielding. Shield connects first, ahead of contacts. 3. ESD Secure Thermoplastic molded covers assures insulatio

文件：409.67 Kbytes 页数：10 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

I/O Card Interface Connectors

■ Features 1. Low Profile Protorusion above the PCB board is only 2.9mm, and the connectors can be mounted to type I and II I/O cards. 2. EMI/RFI protection Full metal shielding. Shield connects first, ahead of contacts. 3. ESD Secure Thermoplastic molded covers assures insulatio

文件：409.67 Kbytes 页数：10 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

I/O Card Interface Connectors

■ Features 1. Low Profile Protorusion above the PCB board is only 2.9mm, and the connectors can be mounted to type I and II I/O cards. 2. EMI/RFI protection Full metal shielding. Shield connects first, ahead of contacts. 3. ESD Secure Thermoplastic molded covers assures insulatio

文件：409.67 Kbytes 页数：10 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

I/O Card Interface Connectors

■ Features 1. Low Profile Protorusion above the PCB board is only 2.9mm, and the connectors can be mounted to type I and II I/O cards. 2. EMI/RFI protection Full metal shielding. Shield connects first, ahead of contacts. 3. ESD Secure Thermoplastic molded covers assures insulatio

文件：409.67 Kbytes 页数：10 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

Simple Assembly Type PC Card Frame Kits

Simple Assembly Type PC Card Frame Kits ■Features 1. Great reduction of the number of frame kit assembly steps Use of this simple assembly method has greatly reduced the number of assembly steps. Processes such heat fusion and cooling of the covers are no longer required. Assembly of

文件：316.09 Kbytes 页数：6 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社