Surface Mount Chip LEDs

Description The MSL-174UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlightin

文件：33.86 Kbytes 页数：2 Pages

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东贝光电

Surface Mount Chip LEDs

Description The MSL-174UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front

文件：34.05 Kbytes 页数：2 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-174UYL, a AMBER source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fron

文件：33.9 Kbytes 页数：2 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-174Y, a YELLOW source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa

文件：34.5 Kbytes 页数：2 Pages

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东贝光电

Surface Mount Chip LEDs

Description The MSL-1947HB3, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fron

文件：70.06 Kbytes 页数：9 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-1947HB3-5, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fr

文件：81.42 Kbytes 页数：10 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-1947HB3, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fron

文件：79.52 Kbytes 页数：10 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-194B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pane

文件：33.38 Kbytes 页数：2 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-194BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel

文件：33.39 Kbytes 页数：2 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-194DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa

文件：34.38 Kbytes 页数：2 Pages

UOT

东贝光电