MSL LOCK SWITCH WITH BRACKETED OR SNAP ON MAINS SWITCH MODULE

FEATURES Double pole Solder terminals – PCB terminals option Made in the UK 2 keys per switch as standard Key removeable in two positions Common or differ keys Master key system available All contacts are non-shorting BBM (break before make) 90° key lock movement Two stage assembly: Lock

文件：330.42 Kbytes 页数：2 Pages

LORLIN

丝印：MSL；Package：DO-214AC；400W Transient Voltage Suppressor (TVS) protection device

Description and applications This device has the ability to clamp dangerous high voltage, short term transients such as produced by directed or radiated electrostatic discharge phenomena before entering sensitive component regions of a circuit design. Response time of clamping action is virtual

文件：489.87 Kbytes 页数：6 Pages

MICROSEMI

美高森美

Side view RGB LEDs

MSL0101 series SRGB-S Features • Side view RGB LEDs • High brightness, superior color mixing

文件：1.048359 Mbytes 页数：4 Pages

ROHM

罗姆

Side view RGB LEDs

MSL0101 series SRGB-S Features • Side view RGB LEDs • High brightness, superior color mixing

文件：1.048359 Mbytes 页数：4 Pages

ROHM

罗姆

SRGB-S

MSL0101 series SRGB-S Features • Side view RGB LEDs • High brightness, superior color mixing

文件：137.52 Kbytes 页数：4 Pages

ROHM

罗姆

Surface Mount Chip LEDs

Description The MSL-154B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features ● Push-Button Backlighting ● LCD Backlighting ● Symbol Backlighting ● Fr

文件：33.43 Kbytes 页数：2 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-154BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel

文件：33.43 Kbytes 页数：2 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-154DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa

文件：34.37 Kbytes 页数：2 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-154G, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel

文件：34.08 Kbytes 页数：2 Pages

UOT

东贝光电

Surface Mount Chip LEDs

Description The MSL-154HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pane

文件：33.75 Kbytes 页数：2 Pages

UOT

东贝光电