High \"Q\", Thin Film, Spiral Inductors

The MACOM Inductors are formed by photolithography and plating techniques on quartz substrates. They eliminate the need for hand forming and “staking” of coil in hybrid circuits. They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect ·No Need for \"Staking\" Coil \n·Passivated Protective Coating Over Coil \n·Dimensional Uniformity \n·Planar Solid Structure Coil ;

MACOM

The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Package height down to 0.6 mm Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices Established package infrastructure with standard CABGA and fcCSP footprints Consistent product performance with high yields and rel

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amkor

安靠科技

Silicon Complementary Transistors Audio Amplifier, Driver

Features: ● High Collector–Emitter Voltage ● Ideal for 25 – 30W Low–Frequency Output Drive

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NTE

GaAlAs Plastic Infrared Emitting Diodes

Plastic Infrared Emitting Diode OP290 Series Description: Each device in this series, is a gallium aluminum arsenide infrared Light Emitting Diode (LED) that is molded in an IR-transmissive package with a wavelength centered at 890 nm, which closely matches the spectral response of silicon photo

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Optek