丝印：8Y；Package：SOT-23；Zeners

文件：204.54 Kbytes 页数：6 Pages

Fairchild

仙童半导体

丝印：8Y；Package：SOT-23；Zeners

文件：57.36 Kbytes 页数：4 Pages

Fairchild

仙童半导体

350mW SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 350mW Power Dissipation on FR-4 PCB • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Quali

文件：66.06 Kbytes 页数：3 Pages

DIODES

美台半导体

350mW SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 350mW Power Dissipation on FR-4 PCB • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes

文件：109.72 Kbytes 页数：5 Pages

DIODES

美台半导体

410 mW Zener Diode 2.4 to 39 Volts

Features • Halogen free available upon request by adding suffix -HF • Lead Free Finish/RoHS Compliant (P Suffix designates RoHS Compliant. See ordering information) • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Wide Voltage Range Available • Small Outline P

文件：617.71 Kbytes 页数：4 Pages

MCC

丝印：BJ；Package：SOT-23；SILICON PLANAR ZENER DIODES

文件：239.22 Kbytes 页数：3 Pages

SEMTECH

先之科

300 MW Surface Mount Zener Diodes

Features ● Planar Die Construction ● 300 mW Power Dissipation on FR-4 PCB ● General Purpose, Medium Current ● Ideally Suited for Automated Assembly Process

文件：372.69 Kbytes 页数：2 Pages

SUNMATE

森美特

350mW Surface Mount Zener Diode

FEATURES ● Planar Die Construction. ● 350mw Power Dissipation. ● General purpose, medium current. ● Ideally Suited For Automated Assembly Prcesses. APPLICATIONS ● 350Mw Surface mount zener diode

文件：219.53 Kbytes 页数：5 Pages

BILIN

银河微电

SURFACE MOUNT ZENER DIODES

SURFACE MOUNT ZENER DIODES Cases:SOT-23 Molded Plastic

文件：21.73 Kbytes 页数：1 Pages

CHENYI

商朗电子

Zener Diode

Features • a225 mW Rating on FR–4 or FR–5 Board. • aSilicon epitaxial planar chip strucuction. • aWide zener reverse voltage range 2.4V to 91V. • aSmall package size for high density applications. • aIdeally suited for automated assembly processes. • aLead-free parts meet environmental stand

文件：555.12 Kbytes 页数：8 Pages

FORMOSA

美丽微半导体