首页 >MCD26/08>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
PowerBridgeRectifiers | SemikronSemikron International 赛米控丹佛斯 | Semikron | ||
PowerBridgeRectifiers | SemikronSemikron International 赛米控丹佛斯 | Semikron | ||
3~phase | SemikronSemikron International 赛米控丹佛斯 | Semikron | ||
Lowthermalresistance MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
Lowthermalresistance MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
Lowthermalresistance MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
Lowthermalresistance MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay |
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