MAX3023

1.2V to 3.6V, 0.1uA, 100Mbps, Single-/Dual-/Quad-Level Translators

GeneralDescription TheMAX13013–MAX13017/MAX3023–MAX3028single-/dual-/quad-leveltranslatorsprovidethelevelshiftingnecessarytoallow100Mbpsdatatransferinamultivoltagesystem.Externallyappliedvoltages,VCCandVL,setthelogiclevelsoneithersideofthedevice.Logicsignalspr

MAX3023

1.2V to 3.6V, 0.1μA, 100Mbps, Single-/Dual-/Quad-Level Translators

MAX3023EBC+TG47

Package：12-WFBGA，CSPBGA；包装：卷带（TR） 类别：集成电路（IC） 转换器，电平移位器 描述：IC TRNSLTR BIDIRECTIONAL 12UCSP

MAX3023EUD+

Package：14-TSSOP（0.173"，4.40mm 宽）；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：集成电路（IC） 转换器，电平移位器 描述：IC TRNSLTR BIDIRECTIONAL 14TSSOP

MAX3023EUD+T

Package：14-TSSOP（0.173"，4.40mm 宽）；包装：管件 类别：集成电路（IC） 转换器，电平移位器 描述：IC TRNSLTR BIDIRECTIONAL 14TSSOP

MCP3023

NON-ZERO-CROSSINGTRIACS

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MIC-3023

3UCompactPCIIntel®6thGen.Quad-Core™ProcessorBlade

Features ƒIntel®6thGen14nmXeon®/Core™processorwithCM236PCH ƒ8Gor16GBDDR4-2133solderedmemorywithECCorNon-ECC ƒMulti-optionstorageas2.5SATA,2280M.2,Cfast,MircoSD,etc ƒ2RJ45GbELAN,2USB3.0,1VGAonfront4HPpanel ƒ1RJ45COM,1HDMI,1USB3.0,2M12X-Coding

MIC-3023

3UCompactPCI®Intel®Quad-CoreAtom™ProcessorBlade

Features ƒSupportsIntel®Atom™ProcessorE3826/E3827/E3845 ƒSupportsupto4GBDDR3L-1333solderedECCmemory ƒOptionalextensionmoduleon8HPandRIOforVGA,LAN,USB,PS/2,Audio, COMports ƒSupportsfanlessapplicationwithoptimizedheatsinkdesign ƒDesignedtomeetEN50121-4and

MIC-3023

3UHeightCompactPCI®Enclosurefor3UCards

Features ƒCPCILegacybackplaneoptions ƒMinifanorfanlessdesign ƒRIOorNon-RIOsupport ƒ21slotsor11slotsdimensionenclosure ƒPICMG2.0,PICMG2.11

MIHW3023

5-6W,Ultra-HighIsolationDIP,Single&DualOutputDC/DCConverters