MADP-042905-13060中文资料下载原装现货-114ic电子网

型号	下载订购	功能描述	制造商上传企业	LOGO
MADP-042905-13060	文件：140.95 Kbytes Page：4 Pages	SURMOUNTTM PIN Diodes 文件：140.95 Kbytes 页数：4 Pages	MA-COM	MA-COM
MADP-042905-130600	文件：707.13 Kbytes Page：5 Pages	Polymer Scratch Protection 文件：707.13 Kbytes 页数：5 Pages	MA-COM	MA-COM
MADP-042905-130600	文件：76.42 Kbytes Page：4 Pages	SURMOUNT TM 5 關m PIN Diodes 文件：76.42 Kbytes 页数：4 Pages	MACOM	MACOM
MADP-042905-13060G	文件：140.95 Kbytes Page：4 Pages	SURMOUNTTM PIN Diodes 文件：140.95 Kbytes 页数：4 Pages	MA-COM	MA-COM
MADP-042905-13060P	文件：140.95 Kbytes Page：4 Pages	SURMOUNTTM PIN Diodes 文件：140.95 Kbytes 页数：4 Pages	MA-COM	MA-COM
MADP-042905-13060T	文件：140.95 Kbytes Page：4 Pages	SURMOUNTTM PIN Diodes 文件：140.95 Kbytes 页数：4 Pages	MA-COM	MA-COM
MADP-042905-130600	文件：300 bytes Page：1 Pages	Surmount PIN Diode This device is a Silicon-Glass PIN diode chip fabricated with MACOM's patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by makin ·Surface Mount\n·RoHS Compliant\n·High Average and Peak Power Handling\n·Low Parasitic Capacitance and Inductance\n·Polymer Scratch Protection\n·Silicon Nitride Passivation\n·Rugged Silicon-Glass Construction\n·No Wirebonds Required;	MACOM	MACOM

更多MADP-042905-13060供应商更新时间2025-12-11 17:57:00