InGaP HBT 2.4 - 2.5 GHz Power Amplifier

DESCRIPTION The LX5535 is a power amplifier optimized for WLAN applications in the 2.4-2.5 GHz frequency range. The PA is implemented as a three-stage monolithic microwave integrated circuit (MMIC) with active bias and output pre-matching. KEY FEATURES ■ Advanced InGaP HBT ■ 2.4-2.5G

文件：74.09 Kbytes 页数：2 Pages

MICROSEMI

美高森美

2.4GHz PA, 3.3-5V, 3x3x0.9mm

The LX5535 is a power amplifier optimized for WLAN applications in the 2.4-2.5 GHz frequency range. The PA is implemented as a three-stage monolithic microwave integrated circuit (MMIC) with active bias and output pre-matching. With single low voltage supply of 5V, it provides 32 dB power gain betwe Advanced InGaP HBT\n2.4-2.5GHz Operation\nSingle-Polarity 3-5V Supply\nQuiescent Current 120mA\nPower Gain 32 dB\nPower for EVM~3.5 % 54Mbps/64QAM : 25dBm\nTotal Current 260mA for Pout=25dBm, 802.11g\n802.11b mask-compliant power : 28dBm\nTotal Current 370mA for Pout=+28dBm, 802.11b\nSmall Footp;

Microchip

微芯科技

InGaP HBT 2.4 - 2.5 GHz Power Amplifier

DESCRIPTION The LX5535 is a power amplifier optimized for WLAN applications in the 2.4-2.5 GHz frequency range. The PA is implemented as a three-stage monolithic microwave integrated circuit (MMIC) with active bias and output pre-matching. KEY FEATURES ■ Advanced InGaP HBT ■ 2.4-2.5G

文件：74.09 Kbytes 页数：2 Pages

MICROSEMI

美高森美

2.4GHz PA, 3.3-5V, 3x3x0.9mm

The LX5535 is a power amplifier optimized for WLAN applications in the 2.4-2.5 GHz frequency range. The PA is implemented as a three-stage monolithic microwave integrated circuit (MMIC) with active bias and output pre-matching. The device is manufactured with an InGaP/GaAs Hetero-junction Bipolar Tr ·Advanced InGaP HBT\n·2.4-2.5GHz Operation\n·Single-Polarity 3-5.5V Supply\n·Quiescent Current 120mA\n·Power Gain 32 dB\n·Power for EVM~3.5 % 54Mbps/64QAM: 25dBm\n·Total Current 260mA for Pout=25dBm, 802.11g\n·802.11b mask-compliant power: 28dBm\n·Total Current 370mA for Pout=+28dBm, 802.11b\n·S;

Microchip

微芯科技

Package：16-VFQFN 裸露焊盘；包装：盒 类别：RF/IF，射频/中频和 RFID 射频放大器 描述：IC RF AMP

MICROCHIP

微芯科技