丝印：JM38510/30001BCA；Package：CDIP；SNx400, SNx4LS00, and SNx4S00 Quadruple 2-Input Positive-NAND Gates

1 Features 1• Package Options Include: – Plastic Small-Outline (D, NS, PS) – Shrink Small-Outline (DB) – Ceramic Flat (W) – Ceramic Chip Carriers (FK) – Standard Plastic (N) – Ceramic (J) • Also Available as Dual 2-Input Positive-NAND Gate in Small-Outline (PS) Package • Inputs Are TTL C

文件：1.69212 Mbytes 页数：38 Pages

TI

德州仪器

丝印：JM38510/30001BDA；Package：CFP；SNx400, SNx4LS00, and SNx4S00 Quadruple 2-Input Positive-NAND Gates

1 Features 1• Package Options Include: – Plastic Small-Outline (D, NS, PS) – Shrink Small-Outline (DB) – Ceramic Flat (W) – Ceramic Chip Carriers (FK) – Standard Plastic (N) – Ceramic (J) • Also Available as Dual 2-Input Positive-NAND Gate in Small-Outline (PS) Package • Inputs Are TTL C

文件：1.69212 Mbytes 页数：38 Pages

TI

德州仪器

丝印：JM38510/30001SCA；Package：CDIP；SNx400, SNx4LS00, and SNx4S00 Quadruple 2-Input Positive-NAND Gates

1 Features 1• Package Options Include: – Plastic Small-Outline (D, NS, PS) – Shrink Small-Outline (DB) – Ceramic Flat (W) – Ceramic Chip Carriers (FK) – Standard Plastic (N) – Ceramic (J) • Also Available as Dual 2-Input Positive-NAND Gate in Small-Outline (PS) Package • Inputs Are TTL C

文件：1.69212 Mbytes 页数：38 Pages

TI

德州仪器

丝印：JM38510/30001SDA；Package：CFP；SNx400, SNx4LS00, and SNx4S00 Quadruple 2-Input Positive-NAND Gates

1 Features 1• Package Options Include: – Plastic Small-Outline (D, NS, PS) – Shrink Small-Outline (DB) – Ceramic Flat (W) – Ceramic Chip Carriers (FK) – Standard Plastic (N) – Ceramic (J) • Also Available as Dual 2-Input Positive-NAND Gate in Small-Outline (PS) Package • Inputs Are TTL C

文件：1.69212 Mbytes 页数：38 Pages

TI

德州仪器

DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR

Package Options Include Plastic Small Outline Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs Depondable Texas Instruments Quality and Reliability

文件：409.11 Kbytes 页数：12 Pages

TI

德州仪器

DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH PRESET AND CLEAR

Package Options Include Plastic Small Outline Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs Depondable Texas Instruments Quality and Reliability

文件：409.11 Kbytes 页数：12 Pages

TI

德州仪器

丝印：30203B2A；Package：LCCC；QUADRUPLE 2-INPUT POSITIVE-NAND BUFFERS WITH OPEN-COLLECTOR OUTPUTS

description These devices contain four independent 2-input NAND buffer gates with open-collector outputs. The open- collector outputs require pull-up resistors to perform correctly. They may be connected to other open- collector outputs to implement active-low wired-OR or active-high wired-A

文件：1.32219 Mbytes 页数：24 Pages

TI

德州仪器

丝印：30203BDA；Package：CFP；QUADRUPLE 2-INPUT POSITIVE-NAND BUFFERS WITH OPEN-COLLECTOR OUTPUTS

description These devices contain four independent 2-input NAND buffer gates with open-collector outputs. The open- collector outputs require pull-up resistors to perform correctly. They may be connected to other open- collector outputs to implement active-low wired-OR or active-high wired-A

文件：1.32219 Mbytes 页数：24 Pages

TI

德州仪器

TRIPLE 3-INPUT POSITIVE-NAND GATES

文件：597.95 Kbytes 页数：14 Pages

TI

德州仪器

TRIPLE 3-INPUT POSITIVE-NAND GATES

文件：935.34 Kbytes 页数：19 Pages

TI

德州仪器