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型号	下载订购	功能描述	制造商上传企业	LOGO
IRKT71	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKT71/04A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKT71/04AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKT71/06A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKT71/06AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKT71/08A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKT71/08AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKT71/10A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKT71/10AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKT71/12A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF

技术参数

SCR 数，二极管：
2 SCRs
电压 - 断态：
600V
电流 - 通态（It（AV））（最大值）：
75A
电流 - 通态（It（RMS））（最大值）：
165A
电压 - 栅极触发（Vgt）（最大值）：
2.5V
电流 - 栅极触发（Igt）（最大值）：
150mA
电流 - 不重复浪涌 50，60Hz（Itsm）：
1665A，1740A
电流 - 保持（Ih）（最大值）：
250mA
工作温度：
-40°C ~ 125°C （TJ）
安装类型：
底座安装
封装/外壳：
ADD-A-PAK（3 + 4）

供应商	型号	品牌	批号	封装	库存	备注	价格
深圳市能元时代电子有限公司	IRKT71	FUJI	23+	模块	20763	##公司主营品牌长期供应100%原装现货可含税提供技术	询价
深圳市勤思达科技有限公司	IRKT71-16	IR			100	原装现货,价格优惠	询价
深圳市毅创腾电子科技有限公司	IRKT71/14	IR	23+	模块	320	全新原装正品,量大可订货!可开17%增值票!价格优势!	询价
深圳市福田区绿盛电子商行	IRKT71-16	IR	2015+	SMD/DIP	19889	一级代理原装现货,特价热卖!	询价
中天科工半导体（深圳）有限公司	IRKT71/04A	IR	专业模块	MODULE	8513	模块原装主营-可开原型号增税票	询价
瀚佳科技(深圳)有限公司	IRKT71/12PPBF	IR/VISH	24+		65230		询价
深圳市科雨电子有限公司	IRKT71/12AS90	IR	25+	MODULE	10	就找我吧!--邀您体验愉快问购元件!	询价
贸泽芯城（深圳）电子科技有限公司	IRKT71/06	IR	23+	MODULE	10000	原厂授权一级代理,专业海外优势订货,价格优势、品种	询价
深圳市蓝山航业科技有限公司	IRKT7104	ir	25+		500000	行业低价,代理渠道	询价
深圳市赛美科科技有限公司	IRKT71-12	IR可控硅模块		原厂封装	1000	一级代理原装正品假一罚十价格优势长期供货	询价

更多IRKT71供应商更新时间2026-6-2 9:09:00

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