THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

文件：319.39 Kbytes 页数：10 Pages

IRF

ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

文件：237.43 Kbytes 页数：10 Pages

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

文件：319.39 Kbytes 页数：10 Pages

IRF

ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

文件：237.43 Kbytes 页数：10 Pages

IRF

ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Infineon

英飞凌

Package：ADD-A-PAK（3 + 4）；包装：散装 类别：分立半导体产品 晶闸管 - SCR - 模块 描述：SCR DBL 2SCR 400V 75A ADD-A-PAK

Vishay General Semiconductor - Diodes Division