THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

文件：319.39 Kbytes 页数：10 Pages

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

文件：319.39 Kbytes 页数：10 Pages

IRF

RECEPTACLE TNC BULKHEAD

文件：52.51 Kbytes 页数：1 Pages

WINCHESTER

温彻斯特

Rectifier Diode

文件：344.1 Kbytes 页数：3 Pages

SEMIKRON

赛米控丹佛斯

Rectifier Diode

文件：344.1 Kbytes 页数：3 Pages

SEMIKRON

赛米控丹佛斯