IRKT91-14资料使用说明书贸易商英飞凌IRF-114ic电子网

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型号	下载订购	功能描述	制造商上传企业	LOGO
IRKT91-14	文件：240.36 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 文件：240.36 Kbytes 页数：10 Pages	IRF	IRF
IRKT91-14	文件：300 bytes Page：1 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR	Infineon 英飞凌	Infineon
IRKT91-14A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF
IRKT91-14AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 页数：10 Pages	IRF	IRF

更多IRKT91-14供应商更新时间2026-3-3 11:04:00