■ Flexible clock management circuitry with up to four phase-locked
loops (PLLs)
– Built-in low-skew clock tree
– Up to eight global clock signals
– ClockLock
?
feature reducing clock delay and skew
– ClockBoost
?
feature providing clock multiplication and division
– ClockShift
TM
programmable clock phase and delay shifting
■ Powerful I/O features
– Compliant with peripheral component interconnect Special
Interest Group (PCI SIG) PCI Local Bus Specification,
Revision 2.2 for 3.3-V operation at 33 or 66 MHz and 32 or 64 bits
– Support for high-speed external memories, including DDR
SDRAM and ZBT SRAM (ZBT is a trademark of Integrated
Device Technology, Inc.)
– Bidirectional I/O performance (tCO + tSU) up to 250 MHz
– LVDS performance up to 840 Mbits per channel
– Direct connection from I/O pins to local interconnect providing
fast tCO and tSU times for complex logic
– MultiVolt I/O interface support to interface with 1.8-V, 2.5-V,
3.3-V, and 5.0-V devices (see Table 3)
– Programmable clamp to VCCIO
– Individual tri-state output enable control for each pin
– Programmable output slew-rate control to reduce switching
noise
– Support for advanced I/O standards, including low-voltage
differential signaling (LVDS), LVPECL, PCI-X, AGP, CTT, stubseries terminated logic (SSTL-3 and SSTL-2), Gunning
transceiver logic plus (GTL+), and high-speed terminated logic
(HSTL Class I)
– Pull-up on I/O pins before and during configuration
■ Advanced interconnect structure
– Four-level hierarchical FastTrack?
Interconnect structure
providing fast, predictable interconnect delays
– Dedicated carry chain that implements arithmetic functions such
as fast adders, counters, and comparators (automatically used by
software tools and megafunctions)
– Dedicated cascade chain that implements high-speed,
high-fan-in logic functions (automatically used by software tools
and megafunctions)
– Interleaved local interconnect allows one LE to drive 29 other
LEs through the fast local interconnect
■ Advanced packaging options
– Available in a variety of packages with 144 to 1,020 pins (see
Tables 4 through 7)
– FineLine BGA?
packages maximize board space efficiency
■ Advanced software support
– Software design support and automatic place-and-route
provided by the Altera?
Quartus?
II development system for
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