IDDD08G65C6中文资料XENSIV ™ - 适用于所有 3D 磁传感器 2GO 套件和 Shield2Go 的线性控制触发器数据手册Infineon规格书

描述 Description

Infineon Technologies introduces Double DPAK (DDPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology CoolSiC™ Schottky diode 650V G6 is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.

特性 Features

• Offers best-in-class VF and FOM Qc x VF
• Improved dv/dt ruggedness
• Easy and effective match with CoolMOS™ 7 SJ MOSFET families
• Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
• Reduced parasitic source inductance improves e iciency and ease-of-use
• Enables higher power density solutions
• Exceeding the highest quality standards

优势:
• Enabling highest energy efficiency
• Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
• Reduced parasitic source inductance improves e iciency and ease-of-use
• Enables higher power density solutions
• Exceeding the highest quality standards

应用 Application

Telecom, Server, Solar, PC power and SMPS

简介

IDDD08G65C6属于分立半导体产品的二极管-整流器-单。由Infineon制造生产的IDDD08G65C6二极管 - 整流器 - 单单整流器二极管系列产品可用于让电流仅沿一个方向流动，并且每个器件封装都恰好实现该功能的一个实例。其他用途的二极管（包括齐纳二极管和可变电容二极管）单独列在各自的产品系列中，每个器件封装中包含多个二极管的产品也是如此。