High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary 1.0nH±0.3nH, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage Mass Production - Standard packaging quantity (minimum) Taping paper 10000pcs

文件：276.96 Kbytes 页数：2 Pages

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High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary    1.2nH±0.3nH, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage    Mass Production - Standard packaging quantity (minimum)    Taping paper 10000pcs

文件：276.96 Kbytes 页数：2 Pages

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High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary    1.5nH±0.3nH, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage    Mass Production - Standard packaging quantity (minimum)    Taping paper 10000pcs

文件：276.96 Kbytes 页数：2 Pages

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High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary    1.8nH±0.3nH, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage    Mass Production - Standard packaging quantity (minimum)    Taping paper 10000pcs

文件：276.96 Kbytes 页数：2 Pages

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High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary 22nH±5, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage Mass Production - Standard packaging quantity (minimum) Taping paper 10000pcs

文件：276.97 Kbytes 页数：2 Pages

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High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary 27nH±5, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage Mass Production - Standard packaging quantity (minimum) Taping paper 10000pcs

文件：276.97 Kbytes 页数：2 Pages

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High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary 2.0nH±0.3nH, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage Mass Production - Standard packaging quantity (minimum) Taping paper 10000pcs

文件：276.96 Kbytes 页数：2 Pages

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太阳诱电

High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary 2.2nH±0.3nH, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage Mass Production - Standard packaging quantity (minimum) Taping paper 10000pcs

文件：276.97 Kbytes 页数：2 Pages

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High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary 2.4nH±0.3nH, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage Mass Production - Standard packaging quantity (minimum) Taping paper 10000pcs

文件：276.97 Kbytes 页数：2 Pages

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MULTILAYER CHIP INDUCTOR FOR HIGH FREQUENCY HK SERIES

FEATURES • Multilayer inductor made of advanced ceramics with low-resistivity silver used as internal conductors provides excellent Q and SRF characteristics. • Designed to address surface mount inductor needs for applications above 100MHz. • Multilayer block structure ensures outstanding relia

文件：107.57 Kbytes 页数：2 Pages

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